Ultra-Low Power Bluetooth Low Energy Audio Solution with Integrated Flash
NXH3675 アラートの受信
The NXH3675 is Bluetooth® 5.3 LE audio certified and supports Auracast™. The Bluetooth audio chip enables HQ audio and supports multi-stream audio, including broadcast with scan and delegator features for audio sharing. Audio profiles like HA, TMAP and other standard profiles are also supported. It is a highly efficient chip designed to function with minimum power consumption and optimized for ultra-low latency applications.
Due to the integrated ultra-low power radio and ultra-low power DSP processing capabilities, the NXH3675 provides exceptionally long battery life and the opportunity to build miniaturized small form-factor products.
The NXH3675 chip integrates the following key functionality:
- Bluetooth 5.3 LE audio certified with Auracast in the 2.4 GHz radio band
- An Arm® Cortex®-M0+ for application control and Bluetooth Low Energy host stack
- A dedicated Arm Cortex-M0+ for supporting full-flexible software link-layer protocol up to the HCI level
- A dual CoolFlux® DSP for audio processing of the LC3 and LC3+ audio encoder/decoder as well as audio and voice enhancements such as EQ, compression, gain control and mixing
- A low-power 16 MHz/32 MHz crystal oscillator with integrated tuning caps and automatic frequency selection
- Integrated flash memory enabling autonomous operation or operation with a host MCU
- Multiple interfaces for control, data, debug and test
- Support for multiple digital PDM-based microphones
- Improves battery life with exceptionally low power consumption
- 20 mW power consumption for gaming headsets
- Includes NXP optimized protocol for ultra-low latency
- High integration enabling small application form factor
NXH3675 and enablement (documentation, software and boards) are available for select customers with an approved NDA. For additional information and sample availability, contact support or your local sales representative.
製品詳細
ブロック図
Features
Application Processors
- Dual core Cortex-M0+
Flash Memory
- Embedded Flash
Audio Processors
- Dual CoolFlux DSP
Bluetooth
- Bluetooth 5.3 LE audio certified with Auracast
Power Management
- Integrated PMU
- Li-ion battery
Audio
- LC3 and LC3+
- Hi-Res Audio (LC3+, 48/96 kHz)
- Equalizer and filtering
- Voice processing
Voice
- Dual digital microphones
- Smart boom - beam forming
General
- Radio PHY conforms to Bluetooth Low Energy 5.3 Bluetooth specification
- Pb-free and compliant with RoHS directive 2011/65/EU (RoHS 2)
- WLCSP package 9.1 mm2 with 48 bumps
- Low number of external passive components
- Operating temperature −20 °C to 85 °C
比較表
| Characteristics | NXH3670 | NXH3675 |
|---|---|---|
| Processor | External Microcontroller | Integrated Quad-Core processor |
| Protocol | BLE 4.2 certified
Proprietary audio streaming protocol |
BLE 5.3 LE audio certified with Auracast™ including scan and delegator for audio sharing, supporting HA and TMAP audio profiles |
| Connections | Point-to-point | Multi-stream up to 7 simultaneously |
| Latency (Down Link) | < 20ms (SBC) | ~20ms (LC3+) |
| NVM | External | Integrated |
| Power Consumption (gaming) | 8.4mW | 8.8mW |
| Audio Codec | SBC / G.722 | LC3 and LC3+ |
| Audio features | EQ and filtering | EQ and filtering
Hi-Res Audio (LC3+ /96khz) Voice processing |
