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- Unlocking the Power of Wi-Fi 6E Through NXP’s Latest IW623 and IW693 with Module Partners
Unlocking the Power of Wi-Fi 6E Through NXP’s Latest IW623 and IW693 with Module Partners
As Wi-Fi 6E becomes the go-to for high-performance, low-latency applications, Wi-Fi 6 remains essential for legacy support and broad device compatibility. Wi-Fi 6E enhances Wi-Fi 6 with the 6 GHz band, extending the spectrum to reduce congestion in dense environments like offices and apartments.
In response, NXP is making it easier than ever for users to adapt, use and deploy solutions enabled with Wi-Fi 6E by partnering with—and reducing time to market for—module vendors such as u-blox, Silex Technology and AzureWave. These Wi-Fi modules—based on IW623 or IW693—simplify development, speed up time to market, reduce overall risk and provide easier prototyping.
Introducing Modules by u-blox
The table below outlines the u-blox modules that integrate Wi‑Fi 6E and Bluetooth® using NXP’s IW623 chipset.
| Product | Wi-Fi I/F | Bluetooth I/F | Operating Temp | Antenna Type | Antenna # | Module Type | Module Size | Qualifications | Recommended Host |
|---|---|---|---|---|---|---|---|---|---|
|
JODY-W672-00B |
PCIe | UART, PCM/I²S | -40 to 85 | Antenna pin(s) | 2 | SMD | 13.8 x 19.8 x 2.5 | AEC-Q104 subset; FCC/ISED, RED/UKCA, GITEKI, BTSIG | i.MX 6/7/8/9 |
|
JODY-W672-50B |
SDIO | UART, PCM/I²S | -40 to 85 | Antenna pin(s) | 2 | SMD | 13.8 x 19.8 x 2.5 | AEC-Q104 subset; FCC/ISED, RED/UKCA, GITEKI, BTSIG | i.MX 6/7/8/9 |
|
JODY-W673-00B |
PCIe | UART, PCM/I²S | -40 to 85 | Antenna pin(s) | 3 | SMD | 13.8 x 19.8 x 2.5 | AEC-Q104; FCC/ISED, RED/UKCA, GITEKI, BTSIG | i.MX 6/7/8/9 |
|
JODY-W673-50B |
SDIO | UART, PCM/I²S | -40 to 85 | Antenna pin(s) | 3 | SMD | 13.8 x 19.8 x 2.5 | AEC-Q104; FCC/ISED, RED/UKCA, GITEKI, BTSIG | i.MX 6/7/8/9 |
u-blox is reshaping what wireless connectivity for the industrial segments looks like by bringing the latest NXP Wi-Fi 6E platform into a compact, powerful and secure module family: JODY-W6. Built on IW623 chipset, JODY-W6 combines tri-band Wi-Fi 6E (2.4/5/6 GHz) with 2x2 MIMO and Bluetooth® Dual-Mode including LE Audio. In addition, the JODY-W6 series features modern security capabilities such as NXP EdgeLock® and secure boot on chip to address growing cybersecurity requirements in industrial IoT deployments.
For customers, the impact is simple: faster go-to-market with less risk. JODY W6 is designed for harsh environments (-40 °C to +85 °C) and targets demanding industrial applications such as industrial automation, healthcare, network infrastructure and smart buildings, including security and surveillance systems – use cases where high throughput, low latency and secure connectivity are non negotiable.
On the integration side, u-blox keeps development friction low: flexible host interfaces (SDIO or PCIe), module variants with two or three antenna pins (respectively JODY-W672 and JODY-W673 ), and pin compatibility within the JODY family to simplify migration across technology generations. By relying on the dependable u-blox’ modules – fully qualified, tested and certified building blocks that reduce NRE, lab time, certification effort and late RF surprises – customers can focus on their differentiation and ship sooner.
Samples of the JODY-W6 (Industrial) will be available starting early Q2 2026, with volume production planned for end of Q2 2026.
Learn about JODY-W6 and more about the u-blox modules based on IW623.
Unveiling Modules by Silex Technology
The table below provides an at‑a‑glance view of Silex Technology’s IW623-based Wi‑Fi 6E module offerings.
| Product | Wi-Fi I/F | Bluetooth I/F | Operating Temp | Antenna Type | Antenna # | Module Type | Module Size | Qualifications | Recommended Host |
|---|---|---|---|---|---|---|---|---|---|
|
SX-SDMAX6E-M2 |
SDIO | UART | -40 to 85 | U.FL Connector(s) | 3 | M.2 E-Key | TBD | FCC, ISED, CE, UKCA, MIC | i.MX |
|
SX-SDMAX6E-2530S |
SDIO | UART | -40 to 85 | RF Pin (Trace) | 3 | SMD | 17.0 x 18.0 x 2.65 | FCC, ISED, CE, UKCA, MIC | i.MX |
The SX-SDMAX6E—powered by NXP's IW623 chipset—is a compact tri-band Wi-Fi 6E module delivering high throughput, low latency and energy-efficient connectivity. It supports:
- 2.4 GHz, 5 GHz and 6 GHz bands with:
- 2x2 multiple-input multiple-output (MIMO)
- Multi-user multiple-input multiple-output (MU-MIMO)
- Orthogonal frequency-division multiple access (OFDMA)
- Target wake time (TWT)
- Bluetooth LE Audio that ensures robust wireless performance, even in dense environments
Silex is thrilled to bring this module to market, opening up new possibilities for medical, industrial and various advanced applications, where both speed and energy efficiency are essential. Its industrial-grade temperature range (-40°C to +85°C) and secure digital input output (SDIO)interface simplify integration for embedded systems and ensure compliance across regions.
Through close collaboration with NXP, the SX-SDMAX6E provides seamless plug-and-play operation on i.MX platforms, eliminating the need for driver-development and integration efforts. Developers can accelerate time to market and deliver high-performance, energy-efficient wireless solutions with confidence, making the SX-SDMAX6E the ideal choice for next-generation connected devices.
Learn more about the efficient Silex modules.
Presenting Modules by AzureWave
The module lineup below showcases how AzureWave is advancing Wi‑Fi 6E adoption with NXP’s latest connectivity SoCs.
| Product | Wi-Fi I/F | Bluetooth I/F | Operating Temp | Antenna Type | Antenna # | Module Type | Module Size | Qualifications | Recommended Host |
|---|---|---|---|---|---|---|---|---|---|
|
AW-XM729 |
PCIe | UART | -40 to 85 | Antenna pin(s) | 2 | SMD | 13 x 15 x 2.25 | FCC | i.MX |
|
AW-XM729 |
SDIO | UART | -40 to 85 | Antenna pin(s) | 2 | SMD | 13 x 15 x 2.25 | FCC | i.MX |
|
AW-XM729MA |
PCIe | UART | -40 to 85 | Antenna pin(s) | 2 | M.2 E-key | 14 x 18 | FCC | i.MX |
|
AW-XM729MA |
SDIO | UART | -40 to 85 | Antenna pin(s) | 2 | M.2 E-key | 14 x 18 | FCC | i.MX |
| Product | Wi-Fi I/F | Bluetooth I/F | Operating Temp | Antenna Type | Antenna # | Module Type | Module Size | Qualifications | Recommended Host |
|---|---|---|---|---|---|---|---|---|---|
|
AW-XM732 |
PCIe | UART | -40 to 85 | Antenna pin(s) | 2 | SMD | 23 x 23 x 3 | FCC | i.MX |
|
AW-XM732MA |
PCIe | UART | -40 to 85 | Antenna pin(s) | 2 | M.2 E-key | 14 x 18 | FCC | i.MX |
Whether you are building next-generation smart home devices or scaling industrial IoT solutions, the AW-XM729 elevates connectivity by providing a reliable foundation for faster, smarter interactions.
The AW-XM729 includes a powerful Wi-Fi subsystem enabling tri-band operation—2.4 GHz, 5 GHz and 6 GHz. It utilizes a 2x2 MU-MIMO configuration and supports up to 80 MHz bandwidth in the 5-7 GHz bands. With support for 1024 quadrature amplitude modulation (QAM) modulation, OFDMA and TWT, it delivers high throughput and power efficiency. As for Bluetooth, it is Bluetooth 5.4 certified, supporting LE Audio, long range (125 kbps/500 kbps) and 2 Mbps high-speed data rates. For host connectivity, the AW-XM729 offers flexible interface options:
- Peripheral Component Interconnect express (PCIe) or SDIO for Wi-Fi and high-speed universal asynchronous receiver-transmitter (UART) for Bluetooth
- Pulse code modulation (PCM) interfaces for voice applications
While many modules tend to sacrifice performance for size, the AzureWave AW-XM732—leveraging the NXP IW693 SoC—is designed for raw power and multitasking. Utilizing a 2x2 MU-MIMO configuration across three bands (2.4/5/6 GHz), it provides the robust throughput necessary for:
- High-definition video streaming: Ideal for medical imaging, 4K security systems and high-concurrency visual smart homes
- Industrial automation: Providing stable, low-latency links for real-time edge computing, digital twins and programmable logic controller (PLC) communication
- Wireless infrastructure: Acting as a high-capacity gateway for wireless Power over Ethernet (PoE) hubs and enterprise-grade IoT access points
The standout feature of AW-XM732 is its support for concurrent dual Wi-Fi (CDW). Unlike standard modules, the AW-XM732 can maintain simultaneous data streams on two different bands (e.g., 5 GHz and 6 GHz). This ensures that critical control signals and high-bandwidth video never compete for airtime, effectively eliminating packet loss and lag in complex environments.
Explore the possibilities that IW623 brings. Learn more about the features and benefits of the IW623 SoC for high-performance wireless designs.
Getting Started with Wi-Fi 6E Connectivity Solutions
Join the many manufacturers who have accelerated the design process and reduced time to market by choosing to develop Wi-Fi modules by leveraging NXP’s broad portfolio of wireless connectivity systems on a chip (SoCs). Silex modules that will be based on IW623 are scheduled to be available in April 2026. These new modules can be paired up with NXP’s, i.MX93, i.MX95 or i.MX8MPLUS to enhance your development journey. Unlock next‑generation wireless performance with NXP’s IW623 or IW693 and turn your ideas into a fully market-ready product. Learn more about IW623 and IW693 on NXP’s Community.
Authors
Trent Bartow
Trent Bartow has led a 20-plus year career in wireless product management and business development roles, spanning across 3G/4G/5G cellular technologies, smartphone platforms, broadband solutions, cellular RAN infrastructure, IIoT wireless connectivity, and automotive applications.
Rakshit Grover
Rakshit Grover is a Technical Marketing Engineer at NXP, working in Product Marketing for Mass Market enablement. He creates technical content highlighting NXP Products in practical, real world scenarios. He completed his Masters in Engineering Management from Duke University specializing in Product Management and draws upon his past experience working in Product Management within the semiconductor Industry and as an Embedded Systems Engineer in the Medical device and Robotics Industry. Outside work, Rakshit is an avid Table Tennis player and enjoys Meditating.