2.4/5 GHzデュアルバンド1x1 Wi-Fi® 6 + Bluetooth Low Energy 5.4 + 802.15.4トライラジオ・ソリューション
i.MX 93W Integrated Wireless Applications Processor: Dual Arm® Cortex®-A55, AI/ML Accelerator, Wi‑Fi 6 + BLE + 802.15.4 Tri-Radio
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The i.MX 93W brings compute and connectivity together by integrating the i.MX 93 applications processor, the IW610G tri‑radio and the complete IW610G radio bill of materials (BOM)—covering - covering passives, crystal and radio frequency (RF) front-end—into a single package. Featuring Arm® Cortex®-A55 and Cortex‑M33 cores, an EdgeLock® Secure Enclave, dedicated neural processor (NPU), dual‑band Wi‑Fi 6, Bluetooth® Low Energy (LE) and 802.15.4.
This integration simplifies RF design, speeds certification and time‑to‑market. It also reduces size and supply‑chain complexity by replacing up to 60 discrete components with a single, pre‑validated solution.
製品詳細
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Features
Multicore Processing
- 1-2x Arm Cortex-A55 @ 1.7 GHz
- Arm Cortex-M33 @ 250Mhz
- Arm® Ethos™ U-65 microNPU
- EdgeLock secure enclave
Connectivity
- 2x USB 2.0 Type C with PHY
- 2x Gb Ethernet: audio/video bridging (AVB) and IEEE 1588 for sync, and energy-efficient Ethernet for low power. 1 with time‑sensitive networking (TSN)
- 1x controller area network flexible data‑rate (CAN FD)
- 7x universal asynchronous receiver‑transmitter (UART), 8x inter‑integrated circuit (I²C), 7x serial peripheral interface (SPI), 2x improved inter‑integrated circuit (I3C)
- 1x 4-ch, 12-bit analog‑to‑digital converter (ADC)
- 2x 32-pin FlexIO interfaces (camera, bus or serial I/O)
External Memory
- Up to 3.7GT/s x16 low‑power double data rate (LPDDR) 4/LPDDR4X —with inline error correction code (ECC)
- 2x SD 3.0/ SDIO3.0/ embedded multimedia card (eMMC)5.1
Graphics
- Hardware Hardware compositor for blending/composition, resize, color space conversion
Display Interfaces
- 1x 1080p60 mobile industry processor interface display serial interface (MIPI‑DSI) (4-lane, 1.5Gbps/lane) with PHY
- 1x 720p60 low‑voltage differential signaling (LVDS) (4-lane)
- 24-bit parallel RGB
Camera Interfaces
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1x 1080p60 mobile industry processor interface camera serial interface (MIPI‑CSI) (2-lane, 1.5Gbps/lane) with physical layer (PHY) 8-bit parallel YUV/RGB
Audio
- 7x I2S time‑division multiplexing (TDM) (32-bit @ 768KHz), Sony/Phillips digital interface (SPDIF) transmit / receive (Tx / Rx)
- 8 channel pulse density modulation (PDM) microphone input
- Medium quality sound (MQS): Medium Quality Sound output (sigma-delta modulator)
Wi-Fi Connectivity
- 1x1 dual band 2.4 GHz / 5 GHz 802.11 a/b/g/n/ax
- 256 quadrature amplitude modulation (QAM), 20 MHz bandwidth, peak throughput: 114.7 Mbps
- Wi-Fi Tx output power up to +21 dBm
- Wi-Fi 6 Extended Range (ER), Dual Carrier Modulation (DCM), Target Wait Time (TWT)
- Low-power Wi-Fi idle, standby and sleep modes
- wi‑fi protected access (WPA) 2 / WPA3 Enterprise security
- Support for Matter over Wi-Fi
- Single, dual antenna with diversity
Bluetooth LE Connectivity
- Switchable Bluetooth LE/802.15.4 operation
- Integrated power amplifier (PA) / (LNA) low noise amplifier / Switch with up to +15 dBm TX output
- High-speed 2 Mbps, long range, advertising extensions
- UART or USB
802.15.4
- IEEE 802.15.4-2015 compliant media access control (MAC)
- 802.15.4 supporting Zigbee and Matter over Thread in 2.4 GHz band
- SPI host Interfaces
Operating Systems
- Linux® OS
- FreeRTOS
Packaging
- 14.2x12mm flip‑chip chip‑scale package (FCCSP), 0.5 mm pitch; with antenna pin
- Fully integrated RF front end, crystal and passives in package
Temperature Range
- Industrial -40⁰C Ta to 105⁰C Tj
