3-Phase Reference Design for HybridPACK™ Drive IGBT/SiC Module Featuring GD3100

RDGD3100I3PH5EVB

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The RDGD3100I3PH5EVB is a fully functional three-phase power gate drive reference design populated with six GD3100 gate drivers with fault management and supporting control circuitry.

This board supports SPI daisy chain communication for programming and communication with three high-side gate drivers and three low-side gate drivers independently. Included is S32SDEV-CON18 PCIe cable for connecting to MCU controller board MPC5777C-DEVB (not included). This board is designed to be connected to a HybridPACK™ Drive IGBT module footprint (not included).

ブロック図

Power Gate Drive

RDGD3100I3PH5EVB Block Diagram

対応製品

プロセッサ＆マイクロコントローラ

超高信頼性MPC57xx MCU

  • MPC5777C: Ultra-Reliable MPC5777C MCU for Automotive and Industrial Engine Management
  • MPC5775B-E: MPC5775B and MPC5775E Microcontrollers for Battery Management Systems (BMS) and Inverter Applications

パワーマネージメント

セーフティSBC

  • FS6500: Grade 1 and Grade 0 Safety Power System Basis Chip with CAN Flexible Data Transceiver

パワートレイン＆エンジン制御

  • GD3100: Advanced High Voltage Isolated Gate Driver for IGBT and SiC MOSFETs

インターフェース

3.3 V/5 V IO CANトランシーバ

  • TJA1042: 高速CANトランシーバ、スタンバイ・モード搭載

Features

MC33GD3100

  • Advanced single-channel gate driver for IGBT© and SiC MOSFETs. Integrated galvanic isolation and low on-resistance drive transistors provide high charging and discharging current, low dynamic saturation voltage and rail-to-rail gate voltage control

Key Features

  • SPI interface for safety monitoring, programmability and flexibility
  • Low propagation delay and minimal PWM distortion
  • Integrated galvanic signal isolation (up to 8 kV)
  • Integrated gate drive power stage capable of 15 A peak source and sink
  • Fully programmable Active Miller clamp
  • Compatible with negative gate supply
  • Compatible with current sense and temperature sense IGBTs
  • Integrated soft shutdown, two-level turn-off, active clamp, and segmented drive for wave shaping
  • CMTI > 100 V/ns
  • Compatible with 200 V to 1700 V IGBT/SiC, power range > 125 kW
  • Operating temperature range −40 °C to 125 °C
  • External creepage distance (CPG): > 7.8 mm
  • Operating frequency > 40 kHz
  • 5.0 V and 3.3 V tolerant MCU interface available

SPI interface

  • Safety monitoring and programming control features
    • PCIe connector provides external I/O connections (including GDIC control and SPI, motor current and application feedback and power supply control), cable harness included
    • PCIe cable harness included
  • Additional SPI test port for GDIC debug
  • Connector for resolver/motor position sense
  • Connector for motor phase current sense

ASIL D ISO 26262 compliant

  • GD3100 is compliant with ISO 26262 ASIL C/D functional safety requirements

AEC-Q100

  • Automotive grade qualified

Safety Features

  • Certified to ASIL D ISO 26262 functional safety requirements for full diagnostics
  • Current, DESAT, and temperature sense inputs and ADC reporting for IGBT/SiC monitoring
  • Fast short-circuit protection, overcurrent protection, temperature warning and shutdown
  • Interrupt pin for fast response to faults
  • Built-in self-check of all analog and digital circuits
  • Continuous watchdog of die-to-die communications
  • Deadtime enforcement
  • Over and undervoltage supervision of all power supplies on both low and high voltage sides
  • Fail-safe state management pins on both low and high voltage sides
  • VGE real time cycle-by-cycle monitoring

Not Included (order separately):

  • MPC5777C-DEVB MCU: Based on the 32-bit Power Architecture® MPC5777C ultra-reliable MCU together with the FS65 System Basis Chip and the TJA1100 and TJA1145T/FD Ethernet and CAN FD PHY transceivers, the MPC5777C-DEVB facilitates hardware and software development, offering system performance, safety, and security.
  • DC link capacitor
  • IGBT module
  • Water cooling jacket

購入オプション

RDGD3100I3PH5EVB-Image

クリックして展開

  • RDGD3100I3PH5EVB

  • 3-Phase Reference Design for HybridPACK Drive IGBT/SiC module featuring GD3100.

  • Kit Contains:

    • RDGD3100I3PH5EVB three-phase power gate drive inverter board
    • Connection cable (S32SDEV-CON18)
  • JP¥107,350
  • の数量に対して 1
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