3. Configure Hardware
FRDM665SPIEVB can be configured as stacked board to S32K344EVB.
3.1 Stacked Board Configuration
As shown in Figure 1, the FRDM665SPIEVB and the S32K344EVB can be connected together and stacked for communication (dual SPI) and power interface. Power can be supplied to the FRDM665SPIEVB with
K3 connector from the S32K344EVB. External power supply to FRDM665SPIEVB with
J6 connector is optional. Check the power LEDs
D14 during this setup or configuration. In case it is not glowing, check the jumper settings at
J13 must be connected appropriately to have VDD5V and VIO to MC33665A from S32K344EVB.
For stacked board configuration, you must remove the four plastic holders placed on four corners of the FRDM665SPIEVB.
3.2 External Board Configuration
FRDM665SPIEVB can be interfaced with external microcontroller boards for SPI and GPIO interface of the MC33665A. Connect 12 V at
J6 or external 5 V to
J11 interface. Select the 5 V to MC33665A with jumper
J8. Care should be taken in selecting the right VIO for both external microcontroller board and FRDM665SPIEVB. Jumper
J13 can be used to select the right VIO for the MC33665A. Before powering up the boards, crosscheck the VIO selection for microcontroller board and FRDM665SPIEVB. Care must be taken for the interconnection wires of request SPI and response SPI from the external MCU to the board to FRDM665SPIEVB. It must be twisted pair with short GND wires interconnecting the boards (FRDM665SPIEVB and MCU).
Communication can be established by the MCU to BCC devices connected on different daisy chain ports with SPI interface on MC33665A.