Embedded system designers face complex double data rate (DDR)memory choices for i.MX processors. Beyond specs, factors like availability, compliance, vendor stability and lifecycle support are crucial. With support from NXP, choosing the right memory ensures a smoother development process for long-term success.
Imagine your design built with the i.MX.
As AI and high-performance computing accelerate the demand for advanced memory technologies, NXP continues to optimize dynamic random-access memory (DRAM) usage across our platforms to balance performance, cost and long-term availability. While next-generation systems move toward higher bandwidth and density, many of our automotive, industrial and IoT solutions depend on proven low-power double data rate 4 (LPDDR4) and low-power double data rate 4X (LPDDR4X) technologies for reliability and extended lifecycle support.
LPDDR4 and LPDDR4x memory technologies are essential for embedded designs built on i.MX applications processors, influencing system cost, power consumption, processing performance, OS compatibility and timelines. LPDDR4x offers reduced voltage operation and improved power-efficiency, making it ideal for battery-powered applications, while LPDDR4 remains a practical choice for industrial and commercial deployments due to cost and a multitude of configuration options. To address space and cost constraints, NXP has qualified compact LPDDR4 / 4x x16 devices in the 100-ball Joint Electron Device Engineering Council (JEDEC) package with i.MX 93 and i.MX 91 full-performance in a smaller footprint while lowering bill of materials (BoM) cost.
Memory requirements and configuration vary across applications and use cases. For example, Edge AI and Display-centric applications typically require higher memory bandwidth and capacity requirements. Industrial and automotive deployments additionally require high-temperature operation and decade-plus component availability. On the other hand, consumer products operate under severe cost constraints where marginal per-unit savings can determine market competitiveness.
NXP’s i.MX 6, i.MX 7 and i.MX 8M systems-on-chip (SoCs) offer support for legacy double data rate 3 low voltage (DDR3L) memory, which remains a viable option for less performance-centric applications. DDR3L is generally more stable in pricing and availability compared to double data rate fourth generation (DDR4), making it ideal for cost-sensitive and long-lifecycle designs. Its maturity and broad ecosystem support also contribute to predictable sourcing and integration.
NXP’s offers S32 Automotive Platform Processing Products which also support multiple DDR interfaces like LPDDR4 and the newest S32N Vehicle Super-Integration Processors will be featuring LPDDR5/5x.
Various factors are considered when choosing the optimal interface/memory.
System designers must balance various product requirements to ensure that optimal memory is chosen.
LPDDR5 defines a significant advancement in low-power memory technology, offering up to 6.4 GT/s data rates, improved energy efficiency and enhanced reliability features such as inline ECC and encryption. These benefits make LPDDR5 ideal for high-performance embedded applications including AI inference, automotive systems and industrial edge computing.
LPDDR5 at 6.4 GT/s data rate delivers higher bandwidth and lower latency, enabling faster boot times, smoother multitasking and reduced power consumption critical for battery-powered and thermally constrained environments. LPDDR5 is especially well-suited for longevity-focused designs, with memory vendors committed to multi-year support and minimal product churn, making it a future-proof choice for mission-critical systems.
NXP’s i.MX 95 and 94 families support LPDDR5 configurations up to x32 width, with Direct Link ECC protocol (DLEP), inline ECC and encryption, ensuring robust data integrity and security. When performance matters and reliability is non-negotiable, NXP’s LPDDR5 support delivers not just speed, but peace of mind. Our i.MX 95 and 94 processors, available now for evaluation, set a new benchmark with DLEP—capabilities competitors simply don’t offer.
NXP views memory support as an integral part of the complete i.MX solution, not as an isolated component selection task. NXP has a collaborative approach to memory integration, ensuring that memory selections match the specific deployment needs of the customer. Additionally, emerging Edge AI applications demand higher memory bandwidth and capacity, and NXP addresses this with new solutions that integrate Kinara AI acceleration into i.MX platforms.
Optimized Software Distributions for Lower Bill of Material (BoM) Costs
Beyond hardware, NXP optimizes software efficiency by evaluating customers’ memory capacity requirements of their operating system and application software while establishing cost targets for favorable market positioning. However, memory configuration needs differ across use cases. For example, Android systems require a minimum of 4GB configurations to satisfy board support package (BSP) bandwidth and capacity requirements.
NXP’s lean Yocto-based Linux distribution can be engineered with minimal memory footprint, reducing RAM requirements and lowering overall BoM costs. This approach empowers customers to achieve cost savings without compromising performance, making NXP’s solution ideal for resource-constrained designs. For example, the i.MX 6ULL family offers support for low-end Linux applications that can leverage NXP’s right-sized Yocto software distributions and fit in low-density DDR3L. In addition, NXP assesses industrial use constraints such as temperature ranges and mechanical stress tolerance, while also considering supply chain factors in light of geopolitical factors and long-term availability requirements.
NXP’s Memory Multi-Vendor Initiative (MVI) delivers extensive JEDEC characterization and validation across numerous memory suppliers. MVI extends beyond functional verification to also provide detailed electrical characterization, signal integrity evaluation and stress testing across various operating conditions. NXP provides customers with verified memory parts that have passed this validation process for specific i.MX processor designs, as well as customized memory interface initialization codes tailored to each vendor’s components.
NXP provides world-class DDR i.MX configuration tools at no cost, preconfiguring memories with visual outputs of the virtual eye diagrams and enabling quicker go-to-market solutions. NXP is also introducing a simplified universal initialization flow that works across multiple DRAM configurations, reducing complexity and accelerating customer system bring-up. The MVI program documentation identifies configuration variations between vendors that design teams must understand for delivering reliable operation. For instance, certain vendors require specific On-Die Termination (ODT) configurations for optimal signal integrity. Other vendors may have different refresh timing requirements or power-down mode characteristics. As part of the MVI, NXP actively validates LPDDR5, LPDDR4 / 4x, DDR4 and DDR3L components across multiple suppliers, providing customers with pre-qualified memory options and tailored initialization code for seamless plug-and-play reliability and integration. For example, we have validated over 10 different memory vendors for i.MX 93 across various configurations.
For industrial and automotive sectors, extended component availability is not for convenience, rather it is a critical business requirement. For example, the automotive recertification costs for a single component substitution can exceed several hundred thousand dollars.
NXP’s Product Longevity Program delivers 10 to 15 years of support for i.MX processors and validated memory subsystems. It partners with memory vendors that demonstrate dedication to stable, extended-term supply and minimal product changes that may require re-designs. The i.MX family SoCs are part of the NXP’s Product Longevity Program including the newest i.MX 9 Family featuring LPDDR4, LPDDR4x and LPDDR5.When component changes do occur, NXP validates the alternatives and supports customers through the migration to minimize disruption. Having access to qualification data and vendor longevity commitments can help customers make informed sourcing decisions.
Memory markets change rapidly due to vendor consolidation, manufacturing capacity shifts and policy changes affecting international trade. U.S. export waiver modifications have disrupted the availability of certain memory components, particularly from select suppliers. These regulatory changes force customers to reconsider vendor relationships and sourcing approaches while balancing project schedules and budgets.
Diversifying memory sourcing has become mandatory for resilience in today’s volatile global market. In response, NXP takes a proactive approach in helping customers maintain continuity by monitoring DRAM vendor supply status and pricing in anticipation of potential disruptions. For example, if acquired, a vendor could consolidate product lines and eliminate SKUs. Another potential scenario—a manufacturing facility issue could create temporary shortages, and export control changes restrict availability from certain suppliers to specific customers or regions.
NXP monitors for these market developments and communicates relevant insights to customers. When supply constraints happen, NXP can identify validated alternative suppliers that meet technical specifications. If cost reduction becomes necessary, NXP’s supplier relationships and market expertise provide alternatives for customers that will not sacrifice performance or quality. NXP also assists customers facing memory vendor supply and pricing challenges by leveraging established memory vendor relationships as well as NXP Partners. In today’s volatile global environment, NXP strongly recommends placing orders well in advance of production builds and—at a minimum—implementing dual-sourcing strategies for memory components. These measures help mitigate supply risks to ensure continuity for critical programs.
Memory selection for i.MX designs involves balancing technical requirements against practical considerations of cost, supply chain resilience and component longevity. By treating the i.MX processor and DDR memory as integrated components of a unified system solution, NXP offers technical validation, supplier partnerships and market intelligence to help customers make more informed decisions.
With support for DDR3L for cost-sensitive designs, LPDDR4 / LPDDR4x for low-power applications and LPDDR5 for next-generation performance—combined with our 10–15-year Product Longevity Program, MVI and lean Yocto distribution—NXP promotes confidence, not compromise. Through our world-class memory validation and enablement, customers can reduce development time and costs by opting for i.MX SoCs paired with the right memories to differentiate their applications from the competition.
Sustaining mature memory nodes is increasingly challenging, but NXP remains committed to securing continuity for customers while exploring scalable architectures—such as chiplets and heterogeneous integration—as well as package solutions that enable future innovation without compromising stability. Where others may offer short-term fixes, NXP delivers resilient long-term solutions that scale with customer roadmaps and shield them from supply chain volatility.
| Feature | DDR3L | DDR4 | LPDDR4/4x | LPDDR5 |
|---|---|---|---|---|
| Current Relative Cost | lowest | high | moderate | Mod-high |
| Performance | Up to 1866 MT/s | Up to 3200 MT/s | Up to 4266 MT/s | Up to 6400 MT/s |
| Power | Moderate | Lower | Very Low | Lowest |
| Density Support | Low | Medium | High | Highest |
| Reliability / ECC | Standard | Standard | Inline | Advanced |
| Long Term Availability | Sustained | Declining | Strong | Emerging support |
| NXP Support | Yes | Yes | Yes | Yes |
Learn more about NXP's i.MX processors and Memory Vendor Initiative at nxp.com/imx.
Links to public Memory Compatibility guides
Asim Zaidi, is a technical director for NXP’s Secure Connected Edge Business Line. He leverages two decades of experience in the embedded semiconductor industry and is currently focused on helping customers enabling memory on the diverse NXP Processor Portfolio.