Presented by
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VP and Head of Strategy Automotive Processing and Automotive Segment, NXP Semiconductors
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VP of Marketing Automotive Processing, NXP Semiconductors
NXPリファレンスデザイン・ライブラリ
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About This Training
OEMs are grappling with constraints in two dimensions: unifying many pieces of software across the vehicle to create a platform for faster rollout of features and new services, and simplifying the physical layout of electronics throughout the vehicle to optimize weight, cost, power and shared functions.
First, the infrastructure of the car has to evolve to support a smarter, software-defined vehicle where data can be shared as needed, optimizing cross-domain applications so that functions can be moved up to the software for faster updating/rollout of new features and more integration in the electronics systems.
Trust in this infrastructure requires safety, security and reliability. Next, zonal control will enable physical simplification, with the opportunity to re-organize the vehicle electronics toward modularity and scalability, while reducing wiring harness weight and cost.
This session will introduce these key innovation areas across the vehicle electronics architecture and outline the implications for future vehicles.
Discover our Vehicle Networking solutions that unlock the value of a connected vehicle.
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