Layerscape® Access LA1575 Programmable Wireless Platform

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Layerscape LA1575 Processor Block Diagram

Layerscape LA1575 Processor Block Diagram

Features

  • Multicore Arm® v8 Processors for user applications
  • Innovative programmable accelerator engines for signal processing.
  • Programmable low latency MAC layer processing engines
  • Programmable high-performance packet processing engines to over 10 Gbps
  • Configurable cryptographic offload engines
  • Multiple Ethernet interfaces including 10Gbps
  • DDR4 with ECC
  • PCIe gen 3.0
  • Integrated Trust architecture
  • Single source clocking
N true 0 PSPLA1575ja 2 アプリケーション・ノート Application Note t789 2 ja ja ja アプリケーション・ノート Application Note 2 1 1 English Solder joint and package temperature for Pb-free BGA in SnPB and Pb-free solders in IR or convection reflow ovens are discussed in this document. 1154542630989715908212 PSP 281.6 KB None None documents None 1154542630989715908212 /docs/en/application-note/AN3300.pdf 281637 /docs/en/application-note/AN3300.pdf AN3300 documents N N 2017-08-17 General soldering Temperature Process Guidelines /docs/en/application-note/AN3300.pdf /docs/en/application-note/AN3300.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Aug 16, 2017 645036621402383989 Application Note Y N General soldering Temperature Process Guidelines 2 0 English This document demonstrates how to determine the package temperature and thermal mass dependent moisture sensitivity level (MSL) of products to ensure reliable processing of moisture sensitive surface mount components. Comply with these recommendations to maintain package integrity of components during any heat exposure of board soldering and de-soldering. 1154542628855726115465 PSP 151.6 KB None None documents None 1154542628855726115465 /docs/en/application-note/AN3298.pdf 151612 /docs/en/application-note/AN3298.pdf AN3298 documents N N 2016-10-31 Solder Joint Temperature and Package Peak Temperature /docs/en/application-note/AN3298.pdf /docs/en/application-note/AN3298.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Aug 2, 2006 645036621402383989 Application Note Y N Solder Joint Temperature and Package Peak Temperature false 0 LA1575 downloads ja true 1 Y PSP アプリケーション・ノート 2 /docs/en/application-note/AN3300.pdf 2017-08-17 1154542630989715908212 PSP 1 Aug 16, 2017 Application Note Solder joint and package temperature for Pb-free BGA in SnPB and Pb-free solders in IR or convection reflow ovens are discussed in this document. None /docs/en/application-note/AN3300.pdf English documents 281637 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN3300.pdf General soldering Temperature Process Guidelines /docs/en/application-note/AN3300.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N General soldering Temperature Process Guidelines 281.6 KB AN3300 N 1154542630989715908212 /docs/en/application-note/AN3298.pdf 2016-10-31 1154542628855726115465 PSP 2 Aug 2, 2006 Application Note This document demonstrates how to determine the package temperature and thermal mass dependent moisture sensitivity level (MSL) of products to ensure reliable processing of moisture sensitive surface mount components. Comply with these recommendations to maintain package integrity of components during any heat exposure of board soldering and de-soldering. None /docs/en/application-note/AN3298.pdf English documents 151612 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN3298.pdf Solder Joint Temperature and Package Peak Temperature /docs/en/application-note/AN3298.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Solder Joint Temperature and Package Peak Temperature 151.6 KB AN3298 N 1154542628855726115465 true Y Products

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