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This EVALUATION KIT features the MC33661 Local Interconnect Network (LIN), which is a serial communication protocol interface device designed to support automotive networks in conjunction with the Local Interconnect Network (LIN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN (Controller Area Network) are not required.
The 33661 is a Physical Layer component dedicated to automotive LIN subbus applications. It offers slew rate selection for optimized operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and programming modes, excellent radiated emission performance, and safe behavior in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode.
This kit is supplied for preliminary evaluation purposes. This evaluation kit was populated with a production (MC33661D) device and datasheet. Current revision of the data sheet available on Web.
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