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The NXP® SCBGADAU1T is a Ball Grid Array (BGA) socket adapter set which allows any 324-pin 1.0 mm pitch MAP BGA surface mount device to be installed into a user's target system. It consists of an Enplas 324-pin Zero Insertion Force (ZIF) socket, an SCBGAMU1T Pin Grid Array (PGA) mini-grid socket adapter, and an SCBGARBU1A BGA base with receivers. The SCBGARBU1A BGA base with receivers is reflowed in the user's target hardware in place of the 324 pin device. The Enplas 324-pin ZIF socket is inserted into the SCBGAMU1T PGA mini-grid socket adapter and the socket assembly is then inserted into the SCBGARBU1A BGA base with receivers. The 324 pin 1.0 mm pitch MAP BGA device is then installed into the BGA ZIF socket. The SCBGADAU1T socket adapter set provides an effective tool for device evaluation and analysis. The SCBGADAU1T supports not only fully balled parts, but has also proven effective for partially de-balled or Land Grid Array (LGA) devices, making it quite useful for failure analysis activities.
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