MC8640HJ1067NE

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC8640HJ1067NELast Revision (GMT):
Tuesday, 06 August 2024, 06:21:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC8640HJ1067NESOT1609-2CFBGA9945860.760700 mg NoNoNoTin/Lead (Sn10Pb90)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 436 585572023-11-2413Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-795.61480065.4000001.631440
Copper and its compoundsCopper, metal7440-50-820.17560013.8000000.344249
Nickel and its compoundsNickel, metal7440-02-028.50900019.5000000.486439
Tin and its compoundsTin, metal7440-31-51.9006001.3000000.032429
Subtotal146.200000100.00000002.494557
Ceramic SubstrateCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1105.8812463.1300001.806613
Barium and its compoundsBarium oxide1304-28-5635.62575218.79000010.845448
Boron and its compoundsBoron oxide1303-86-2139.7091204.1300002.383805
Calcium and its compoundsCalcium monoxide1305-78-877.4658312.2900001.321771
Chromium and Chromium III compoundsDichromium trioxide1308-38-913.5311500.4000000.230877
Copper and its compoundsCuprous oxide1317-39-13.3827870.1000000.057719
Inorganic Silicon compoundsSilicon dioxide7631-86-92331.07879768.91000039.774338
Strontium and its compoundsStrontium Oxide1314-11-08.4569690.2500000.144298
Zirconium and its compoundsZirconium oxide1314-23-467.6557482.0000001.154385
Subtotal3382.787400100.000000057.719255
Gold PlatingGold and its compoundsGold, metal7440-57-52.35164599.9900000.040125
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0002350.0100000.000004
Subtotal2.351880100.00000000.040129
Nickel PlatingLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0105830.0600000.000181
Nickel and its compoundsNickel, metal7440-02-015.85049589.8600000.270451
Palladium and its compoundsPalladium, metal7440-05-30.1905021.0800000.003250
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-01.5875199.0000000.027087
Subtotal17.639100100.00000000.300970
Under Bump MetalClayCeramic materials and wares66402-68-421.6115044.1800000.368749
Copper and its compoundsCopper, metal7440-50-8495.41011695.8200008.453000
Subtotal517.021620100.00000008.821749
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped287.40696389.6000004.903919
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.8869000.9000000.049258
Nickel and its compoundsNickel, metal7440-02-01.6038330.5000000.027366
Silver and its compoundsSilver, metal7440-22-41.0104150.3150000.017240
Tin and its compoundsTin, metal7440-31-527.8585888.6850000.475341
Subtotal320.766700100.00000005.473124
Solder Ball - High LeadSolder Ball - High LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-11130.75317789.57000019.293625
Tin and its compoundsTin, metal7440-31-5131.67082310.4300002.246651
Subtotal1262.424000100.000000021.540275
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-851.53100096.5000000.879255
Silver and its compoundsSilver, metal7440-22-41.6020003.0000000.027334
Tin and its compoundsTin, metal7440-31-50.2670000.5000000.004556
Subtotal53.400000100.00000000.911145
Solder PasteSolder PasteLead and its compoundsLead, metallic lead and lead alloys7439-92-131.64980037.0000000.540029
Tin and its compoundsTin, metal7440-31-553.89020063.0000000.919509
Subtotal85.540000100.00000001.459537
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-37.98930011.0000000.136319
Bismuth and its compoundsBismuth nitrate10361-44-10.0726300.1000000.001239
Bismuth and its compoundsBismuth trioxide1304-76-30.5810400.8000000.009914
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-610.16820014.0000000.173496
Epoxy ResinsOther Epoxy resins2.9052004.0000000.049570
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.26300010.0000000.123926
Inorganic Silicon compoundsSilica, vitreous60676-86-043.57800060.0000000.743555
Inorganic compoundsCarbon Black1333-86-40.0726300.1000000.001239
Subtotal72.630000100.00000001.239259
Total5860.760700100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC8640HJ1067NE
Product content declaration of MC8640HJ1067NE
上次修订 Last Revision (GMT):
Tuesday, 06 August 2024, 06:21:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
陶瓷基板
Ceramic Substrate
陶瓷的
Ceramic
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 高铅
Solder Ball - High Lead
焊球 - 高铅
Solder Ball - High Lead
XOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
XOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC8640HJ1067NELast Revision (GMT):
Tuesday, 06 August 2024, 06:21:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Ceramic SubstrateAU PLATINGNot AvailableNot AvailableNot AvailableNot Available
CERAMICNot AvailableNot AvailableNot AvailableNot Available
METALLIZATIONNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
28 Mar 2023
Solder Ball - High LeadNot AvailableNot AvailableNot AvailableNot Available
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Solder PasteNot AvailableNot AvailableNot AvailableNot Available
UnderfillTest Report
11 Sep 2024
Test Report
11 Sep 2024
Test Report
11 Sep 2024
Test Report
11 Sep 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.