AFSC5G40E38T2

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Product content declaration of AFSC5G40E38T2		Last Revision (GMT): Thursday, 24 July 2025, 07:24:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G40E38T2	SOT1831	HLLGA27	116.147018 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 096 47528	2024-12-13	F	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.616236	99.990000	0.530566
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000062	0.010000	0.000053
			Subtotal		0.616298	100.0000000	0.530619

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.046062
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.009213
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.018425
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.110549
			Subtotal		0.214000	100.0000000	0.184249
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.007748
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.007749
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.006026
			Subtotal		0.007000	100.0000000	0.006027
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001378
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.061990
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.005510
			Subtotal		0.080000	100.0000000	0.068878
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.017218
			Subtotal		0.020000	100.0000000	0.017219

Capacitor 2	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132000	60.000000	0.113649
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022000	10.000000	0.018942
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.056825
			Subtotal		0.220000	100.0000000	0.189415
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007999	99.990000	0.006887
			Subtotal		0.008000	100.0000000	0.006888
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.006026
			Subtotal		0.007000	100.0000000	0.006027
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.001309
		Copper and its compounds	Copper, metal	7440-50-8	0.068400	90.000000	0.058891
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.005235
			Subtotal		0.076000	100.0000000	0.065434
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.018998	99.990000	0.016357
			Subtotal		0.019000	100.0000000	0.016359

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051137	25.000000	0.044028
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010228	5.000000	0.008806
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020455	10.000000	0.017611
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.122729	60.000000	0.105667
			Subtotal		0.204549	100.0000000	0.176112
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008503	99.900000	0.007321
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000007
			Subtotal		0.008512	100.0000000	0.007328
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000011
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012755	99.900000	0.010982
			Subtotal		0.012768	100.0000000	0.010993
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002556	2.000000	0.002201
		Copper and its compounds	Copper, metal	7440-50-8	0.115012	90.000000	0.099022
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010223	8.000000	0.008802
			Subtotal		0.127791	100.0000000	0.110025
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000026
		Tin and its compounds	Tin, metal	7440-31-5	0.029761	99.900000	0.025624
			Subtotal		0.029791	100.0000000	0.025649

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.010335
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.002067
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.004134
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.024804
			Subtotal		0.048015	100.0000000	0.041340
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001718
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000002
			Subtotal		0.001998	100.0000000	0.001720
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.002578
			Subtotal		0.002997	100.0000000	0.002580
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000517
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.023244
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.002066
			Subtotal		0.029997	100.0000000	0.025827
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000006
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.006015
			Subtotal		0.006993	100.0000000	0.006021

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.053642
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.010728
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.021457
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.128740
			Subtotal		0.249213	100.0000000	0.214567
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.009023
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.009024
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.007018
			Subtotal		0.008152	100.0000000	0.007019
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001604
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.072191
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.006417
			Subtotal		0.093163	100.0000000	0.080212
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.020051
			Subtotal		0.023291	100.0000000	0.020053

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.032424	25.000000	0.027917
		Manganese and its compounds	Manganese oxide	1344-43-0	0.006485	5.000000	0.005583
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.012970	10.000000	0.011167
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.077818	60.000000	0.067000
			Subtotal		0.129697	100.0000000	0.111666
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.005454	99.990000	0.004696
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.005455	100.0000000	0.004696
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.004241	99.990000	0.003652
			Subtotal		0.004242	100.0000000	0.003653
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000970	2.000000	0.000835
		Copper and its compounds	Copper, metal	7440-50-8	0.043636	90.000000	0.037570
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003879	8.000000	0.003340
			Subtotal		0.048485	100.0000000	0.041744
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.012120	99.990000	0.010435
			Subtotal		0.012121	100.0000000	0.010436

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.020670
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.004134
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.008268
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.049608
			Subtotal		0.096030	100.0000000	0.082680
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.003437
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.003440
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.005156
			Subtotal		0.005994	100.0000000	0.005161
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.001033
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.046488
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.004132
			Subtotal		0.059994	100.0000000	0.051654
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000012
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.012030
			Subtotal		0.013986	100.0000000	0.012042

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		4.891100	5.000000	4.211128
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	85.105140	87.000000	73.273633
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	2.934660	3.000000	2.526677
		Inorganic compounds	Carbon Black	1333-86-4	0.489110	0.500000	0.421113
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.097822	0.100000	0.084223
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271686	1.300000	1.094893
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		2.934660	3.000000	2.526677
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.097822	0.100000	0.084223
			Subtotal		97.822000	100.0000000	84.222567

Epoxy Adhesive	Epoxy Adhesive	Anhydrides	Proprietary Material - Other anhydrides		0.028170	3.000000	0.024254
		Epoxy Resins	Proprietary Material-Other Epoxy resins		0.061035	6.500000	0.052550
		Organic Silicon compounds	(3,4-Epoxycyclohexyl)ethyltrimethoxysilane	3388-04-3	0.004695	0.500000	0.004042
		Silver and its compounds	Silver, metal	7440-22-4	0.845100	90.000000	0.727612
			Subtotal		0.939000	100.0000000	0.808458

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.082354	40.000000	0.070905
		Boron and its compounds	Boron oxide	1303-86-2	0.020588	10.000000	0.017726
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.102942	50.000000	0.088631
			Subtotal		0.205884	100.0000000	0.177262
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000041	0.100000	0.000036
		Silver and its compounds	Silver, metal	7440-22-4	0.041136	99.900000	0.035417
			Subtotal		0.041177	100.0000000	0.035453
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000014	0.100000	0.000012
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013573	99.900000	0.011686
			Subtotal		0.013587	100.0000000	0.011698
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000056	0.100000	0.000048
		Silver and its compounds	Silver, metal	7440-22-4	0.055531	99.900000	0.047811
			Subtotal		0.055587	100.0000000	0.047859
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000782	5.000000	0.000674
		Boron and its compounds	Boron oxide	1303-86-2	0.002347	15.000000	0.002021
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000782	5.000000	0.000674
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010954	70.000000	0.009431
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000782	5.000000	0.000674
			Subtotal		0.015648	100.0000000	0.013473
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000018	0.100000	0.000016
		Tin and its compounds	Tin, metal	7440-31-5	0.018098	99.900000	0.015582
			Subtotal		0.018116	100.0000000	0.015598

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.060000	40.000000	0.051659
		Boron and its compounds	Boron oxide	1303-86-2	0.015000	10.000000	0.012915
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.075001	50.000000	0.064574
			Subtotal		0.150001	100.0000000	0.129148
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000570	5.000000	0.000491
		Boron and its compounds	Boron oxide	1303-86-2	0.001710	15.000000	0.001472
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000570	5.000000	0.000491
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007981	70.000000	0.006871
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000570	5.000000	0.000491
			Subtotal		0.011401	100.0000000	0.009816
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000030	0.100000	0.000026
		Silver and its compounds	Silver, metal	7440-22-4	0.029971	99.900000	0.025804
			Subtotal		0.030001	100.0000000	0.025830
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000010	0.100000	0.000008
		Nickel and its compounds	Nickel, metal	7440-02-0	0.009889	99.900000	0.008514
			Subtotal		0.009899	100.0000000	0.008523
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000041	0.100000	0.000035
		Silver and its compounds	Silver, metal	7440-22-4	0.040459	99.900000	0.034834
			Subtotal		0.040499	100.0000000	0.034869
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000011
		Tin and its compounds	Tin, metal	7440-31-5	0.013186	99.900000	0.011352
			Subtotal		0.013199	100.0000000	0.011364

Resistor 1	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.023154	96.100000	0.019935
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000096	0.400000	0.000083
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000361	1.500000	0.000311
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000482	2.000000	0.000415
			Subtotal		0.024093	100.0000000	0.020744
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000119
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000010
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000040
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000692
			Subtotal		0.001000	100.0000000	0.000861
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000039
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000002
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000023
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000032
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000765
			Subtotal		0.001000	100.0000000	0.000861
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000143
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000037
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000215
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.000466
			Subtotal		0.001000	100.0000000	0.000861
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001729	99.990000	0.001489
			Subtotal		0.001730	100.0000000	0.001489
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000058
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000650
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000009
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000145
			Subtotal		0.001000	100.0000000	0.000861
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000072	5.510000	0.000062
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	0.900000	0.000010
		Copper and its compounds	Cupric oxide	1317-38-0	0.000012	0.900000	0.000010
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000257	19.540000	0.000221
		Lead and its compounds	Lead monooxide	1317-36-8	0.000074	5.650000	0.000064
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000024	1.800000	0.000020
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000118	9.020000	0.000102
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000118	9.020000	0.000102
		Silver and its compounds	Silver, metal	7440-22-4	0.000565	43.050000	0.000487
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000037	2.810000	0.000032
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000024	1.800000	0.000020
			Subtotal		0.001313	100.0000000	0.001130
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000301
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000560
			Subtotal		0.001000	100.0000000	0.000861
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.002593	99.990000	0.002233
			Subtotal		0.002594	100.0000000	0.002234

Resistor 2	Alumina Substrate	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.194663	96.000000	0.167601
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000811	0.400000	0.000698
		Inorganic Silicon compounds	Quartz	14808-60-7	0.004056	2.000000	0.003492
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.003244	1.600000	0.002793
			Subtotal		0.202774	100.0000000	0.174584
	Bottom Conductor	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.001362	20.000000	0.001173
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000340	5.000000	0.000293
		Non-Halogenated Organic Compounds - Specific	Gum rosin, colophony	8050-09-7	0.000681	10.000000	0.000586
		Silver and its compounds	Silver, metal	7440-22-4	0.004427	65.000000	0.003812
			Subtotal		0.006811	100.0000000	0.005864
	Glaze	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.001502	80.000000	0.001293
		Polymers	Ethyl cellulose	9004-57-3	0.000376	20.000000	0.000323
			Subtotal		0.001878	100.0000000	0.001617
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.010941	99.990000	0.009420
			Subtotal		0.010943	100.0000000	0.009421
	Protective Coating	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.001653	40.000000	0.001423
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000826	20.000000	0.000711
		Inorganic compounds	Carbon Black	1333-86-4	0.000413	10.000000	0.000356
		Magnesium and its compounds	Talc	14807-96-6	0.000620	15.000000	0.000534
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000620	15.000000	0.000534
			Subtotal		0.004132	100.0000000	0.003557
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.002299	45.000000	0.001979
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000511	10.000000	0.000440
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.002043	40.000000	0.001759
		Silver and its compounds	Silver (I) oxide	20667-12-3	0.000255	5.000000	0.000220
			Subtotal		0.005108	100.0000000	0.004398
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000431	20.000000	0.000371
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001723	80.000000	0.001483
			Subtotal		0.002153	100.0000000	0.001854
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.010941	99.990000	0.009420
			Subtotal		0.010943	100.0000000	0.009421
	Top Conductor	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000566	10.000000	0.000487
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000057	1.000000	0.000049
		Silver and its compounds	Silver, metal	7440-22-4	0.005037	89.000000	0.004336
			Subtotal		0.005659	100.0000000	0.004872

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.266638	98.000000	0.229570
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005442	2.000000	0.004685
			Subtotal		0.272080	100.0000000	0.234255

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	1.610826	98.000000	1.386885
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.032874	2.000000	0.028304
			Subtotal		1.643700	100.0000000	1.415189

Semiconductor Die 3	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	8.509402	89.600000	7.326406
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.085474	0.900000	0.073591
		Nickel and its compounds	Nickel, metal	7440-02-0	0.047485	0.500000	0.040884
		Silver and its compounds	Silver, metal	7440-22-4	0.029916	0.315000	0.025757
		Tin and its compounds	Tin, metal	7440-31-5	0.824823	8.685000	0.710154
			Subtotal		9.497100	100.0000000	8.176792

Solder Flux	Solder Flux	Copper and its compounds	Copper, metal	7440-50-8	0.003763	2.986400	0.003240
		Glycol Ethers and Acetates - Specific	2-(2-butoxyethoxy)ethanol	112-34-5	0.003425	2.718100	0.002949
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.015688	12.450900	0.013507
		Silver and its compounds	Silver, metal	7440-22-4	0.005425	4.305300	0.004671
		Tin and its compounds	Tin, metal	7440-31-5	0.097699	77.539300	0.084117
			Subtotal		0.126000	100.0000000	0.108483

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007215	0.500000	0.006212
		Silver and its compounds	Silver, metal	7440-22-4	0.043290	3.000000	0.037272
		Tin and its compounds	Tin, metal	7440-31-5	1.392495	96.500000	1.198907
			Subtotal		1.443000	100.0000000	1.242391

Substrate, Pre-plated NiPdAu	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	0.054611	99.900000	0.047019
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000055	0.100000	0.000047
			Subtotal		0.054666	100.0000000	0.047066
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	0.579697	99.900000	0.499106
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000580	0.100000	0.000500
			Subtotal		0.580277	100.0000000	0.499606
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.005015	99.900000	0.004318
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000005	0.100000	0.000004
			Subtotal		0.005020	100.0000000	0.004322
	Solder Mask	Aromatic amines and their salts	1,3,5-Triazine-2,4,6-triamine	108-78-1	0.000033	0.100000	0.000028
		Barium and its compounds	Barium sulfate	7727-43-7	0.006376	19.500000	0.005489
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003237	9.900000	0.002787
		Magnesium and its compounds	Talc	14807-96-6	0.000948	2.900000	0.000816
		Organic compounds	Other organic compounds.		0.001766	5.400000	0.001520
		Phosphorus compounds	Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide	75980-60-8	0.000262	0.800000	0.000225
		Polymers	Plastic: EP - Epoxide, Epoxy		0.004054	12.400000	0.003491
		Polymers	Plastic: PAK		0.016021	49.000000	0.013794
			Subtotal		0.032697	100.0000000	0.028151
	Substrate Prepreg	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.078562	24.000000	0.067640
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.146648	44.800000	0.126261
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.023896	7.300000	0.020574
		Polymers	Plastic: EP - Epoxide, Epoxy		0.078234	23.900000	0.067358
			Subtotal		0.327340	100.0000000	0.281833

			Total		116.147018	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G40E38T2 Product content declaration of AFSC5G40E38T2		上次修订 Last Revision (GMT): Thursday, 24 July 2025, 07:24:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 2	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	底导体 Bottom Conductor	O	O	O	O	O	O
	釉 Glaze	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	铜箔 Copper Foil	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O
	基材预浸料 Substrate Prepreg	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G40E38T2		Last Revision (GMT): Thursday, 24 July 2025, 07:24:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 12 May 2025	Test Report 12 May 2025	Test Report 12 May 2025	Test Report 12 May 2025
Capacitor 1	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 2	CERAMIC	Test Report 27 Oct 2025	Test Report 27 Oct 2025	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 3	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 4	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 5	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 6	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 7	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Die Encapsulant		Test Report 16 Jan 2025	Test Report 16 Jan 2025	Test Report 16 Jan 2025	Test Report 16 Jan 2025
Epoxy Adhesive		Test Report 29 Jul 2025	Test Report 29 Jul 2025	Test Report 29 Jul 2025	Not Available
Inductor 1	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	INNER GLAZE	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Not Available	Not Available
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER GLAZE	Test Report 18 Sep 2025	Test Report 18 Sep 2025	Not Available	Not Available
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Inductor 2	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	INNER GLAZE	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER GLAZE	Test Report 18 Sep 2025	Test Report 18 Sep 2025	Test Report 18 Sep 2025	Test Report 18 Sep 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Resistor 1	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Resistor 2	CERAMIC	Not Available	Not Available	Test Report 13 Feb 2020	Not Available
	EXTERNAL ELECTRODE	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
	INTERNAL ELECTRODE	Test Report 27 Dec 2019	Test Report 27 Dec 2019	Test Report 27 Dec 2019	Test Report 27 Dec 2019
	NI PLATING	Not Available	Not Available	Test Report 4 Oct 2020	Test Report 4 Oct 2020
	OVERCOAT	Test Report 20 Feb 2024	Test Report 20 Feb 2024	Not Available	Not Available
	OVERGLAZE	Test Report 31 Jan 2024	Test Report 31 Jan 2024	Test Report 31 Jan 2024	Test Report 31 Jan 2024
	RESISTIVE ELECTRODE	Test Report 19 Mar 2024	Test Report 19 Mar 2024	Not Available	Not Available
	SECONDARY ELECTRODE	Test Report 30 Jun 2023	Test Report 30 Jun 2023	Test Report 30 Jun 2023	Test Report 30 Jun 2023
	SN PLATING	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
	SUSBTRATE	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Not Available	Test Report 13 Feb 2020
Semiconductor Die 1		Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Semiconductor Die 2		Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Semiconductor Die 3		Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Solder Flux		Test Report 11 Oct 2024	Test Report 11 Oct 2024	Not Available	Not Available
Solder Paste		Test Report 24 Oct 2024	Test Report 24 Oct 2024	Test Report 24 Oct 2024	Test Report 24 Oct 2024
Substrate, Pre-plated NiPdAu		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer