AFSC5G37D37T2

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Product content declaration of AFSC5G37D37T2		Last Revision (GMT): Wednesday, 05 November 2025, 11:56:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G37D37T2	SOT1831	HLLGA27	141.079991 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Not Applicable	Other	Not Applicable	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 777 67528	2025-06-17	N	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.091682	99.990000	0.064986
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000009	0.010000	0.000006
			Subtotal		0.091691	100.0000000	0.064992

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.023341	25.000000	0.016544
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004668	5.000000	0.003309
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009336	10.000000	0.006618
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.056017	60.000000	0.039706
			Subtotal		0.093363	100.0000000	0.066177
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003881	99.900000	0.002751
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003885	100.0000000	0.002754
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005822	99.900000	0.004126
			Subtotal		0.005828	100.0000000	0.004131
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001167	2.000000	0.000827
		Copper and its compounds	Copper, metal	7440-50-8	0.052495	90.000000	0.037209
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004666	8.000000	0.003308
			Subtotal		0.058327	100.0000000	0.041344
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000010
		Tin and its compounds	Tin, metal	7440-31-5	0.013584	99.900000	0.009628
			Subtotal		0.013598	100.0000000	0.009638

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.008509
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001702
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.003403
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.020420
			Subtotal		0.048015	100.0000000	0.034034
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001415
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001998	100.0000000	0.001416
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.002122
			Subtotal		0.002997	100.0000000	0.002124
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000425
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.019136
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001701
			Subtotal		0.029997	100.0000000	0.021262
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000005
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.004952
			Subtotal		0.006993	100.0000000	0.004957

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.008509
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001702
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.003403
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.020420
			Subtotal		0.048015	100.0000000	0.034034
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001415
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001998	100.0000000	0.001416
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.002122
			Subtotal		0.002997	100.0000000	0.002124
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000425
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.019136
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001701
			Subtotal		0.029997	100.0000000	0.021262
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000005
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.004952
			Subtotal		0.006993	100.0000000	0.004957

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.014591	25.000000	0.010342
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002918	5.000000	0.002069
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005836	10.000000	0.004137
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.035018	60.000000	0.024821
			Subtotal		0.058364	100.0000000	0.041369
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.002454	99.990000	0.001740
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.002455	100.0000000	0.001740
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001908	99.990000	0.001353
			Subtotal		0.001909	100.0000000	0.001353
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000436	2.000000	0.000309
		Copper and its compounds	Copper, metal	7440-50-8	0.019636	90.000000	0.013919
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001746	8.000000	0.001237
			Subtotal		0.021818	100.0000000	0.015465
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.005454	99.990000	0.003866
			Subtotal		0.005455	100.0000000	0.003866

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.014591	25.000000	0.010342
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002918	5.000000	0.002069
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005836	10.000000	0.004137
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.035018	60.000000	0.024821
			Subtotal		0.058364	100.0000000	0.041369
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.002454	99.990000	0.001740
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.002455	100.0000000	0.001740
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001908	99.990000	0.001353
			Subtotal		0.001909	100.0000000	0.001353
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000436	2.000000	0.000309
		Copper and its compounds	Copper, metal	7440-50-8	0.019636	90.000000	0.013919
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001746	8.000000	0.001237
			Subtotal		0.021818	100.0000000	0.015465
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.005454	99.990000	0.003866
			Subtotal		0.005455	100.0000000	0.003866

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		5.710600	5.000000	4.047775
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	99.364440	87.000000	70.431277
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	3.426360	3.000000	2.428665
		Inorganic compounds	Carbon Black	1333-86-4	0.571060	0.500000	0.404778
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.114212	0.100000	0.080955
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.484756	1.300000	1.052421
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		3.426360	3.000000	2.428665
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.114212	0.100000	0.080955
			Subtotal		114.212000	100.0000000	80.955491

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.031836	3.061200	0.022566
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.031836	3.061200	0.022566
		Silver and its compounds	Silver, metal	7440-22-4	0.976327	93.877600	0.692038
			Subtotal		1.040000	100.0000000	0.737170

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.018824	40.000000	0.013343
		Boron and its compounds	Boron oxide	1303-86-2	0.004706	10.000000	0.003336
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.023530	50.000000	0.016678
			Subtotal		0.047059	100.0000000	0.033356
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000179	5.000000	0.000127
		Boron and its compounds	Boron oxide	1303-86-2	0.000536	15.000000	0.000380
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000179	5.000000	0.000127
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002504	70.000000	0.001775
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000179	5.000000	0.000127
			Subtotal		0.003577	100.0000000	0.002535
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000009	0.100000	0.000007
		Silver and its compounds	Silver, metal	7440-22-4	0.009403	99.900000	0.006665
			Subtotal		0.009412	100.0000000	0.006671
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003102	99.900000	0.002199
			Subtotal		0.003106	100.0000000	0.002201
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000009
		Silver and its compounds	Silver, metal	7440-22-4	0.012693	99.900000	0.008997
			Subtotal		0.012706	100.0000000	0.009006
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.004137	99.900000	0.002932
			Subtotal		0.004141	100.0000000	0.002935

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.035294	40.000000	0.025017
		Boron and its compounds	Boron oxide	1303-86-2	0.008823	10.000000	0.006254
		Inorganic Silicon compounds	Quartz	14808-60-7	0.044117	50.000000	0.031271
			Subtotal		0.088234	100.0000000	0.062542
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.017646	99.990000	0.012508
			Subtotal		0.017647	100.0000000	0.012509
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005822	99.990000	0.004127
			Subtotal		0.005823	100.0000000	0.004127
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.023821	99.990000	0.016885
			Subtotal		0.023823	100.0000000	0.016886
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000335	5.000000	0.000238
		Boron and its compounds	Boron oxide	1303-86-2	0.001006	15.000000	0.000713
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000335	5.000000	0.000238
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004696	70.000000	0.003328
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000335	5.000000	0.000238
			Subtotal		0.006708	100.0000000	0.004755
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.007763	99.990000	0.005503
			Subtotal		0.007764	100.0000000	0.005503

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.035294	40.000000	0.025017
		Boron and its compounds	Boron oxide	1303-86-2	0.008823	10.000000	0.006254
		Inorganic Silicon compounds	Quartz	14808-60-7	0.044117	50.000000	0.031271
			Subtotal		0.088234	100.0000000	0.062542
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.017646	99.990000	0.012508
			Subtotal		0.017647	100.0000000	0.012509
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005822	99.990000	0.004127
			Subtotal		0.005823	100.0000000	0.004127
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.023821	99.990000	0.016885
			Subtotal		0.023823	100.0000000	0.016886
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000335	5.000000	0.000238
		Boron and its compounds	Boron oxide	1303-86-2	0.001006	15.000000	0.000713
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000335	5.000000	0.000238
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004696	70.000000	0.003328
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000335	5.000000	0.000238
			Subtotal		0.006708	100.0000000	0.004755
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.007763	99.990000	0.005503
			Subtotal		0.007764	100.0000000	0.005503

Inductor 4	Inductor	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.043400	24.800000	0.030763
		Boron and its compounds	Boron oxide	1303-86-2	0.011900	6.800000	0.008435
		Cobalt and its compounds	C.I. Pigment Blue 28	1345-16-0	0.000700	0.400000	0.000496
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.061600	35.200000	0.043663
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008400	4.800000	0.005954
		Silver and its compounds	Silver, metal	7440-22-4	0.038150	21.800000	0.027041
		Tin and its compounds	Tin, metal	7440-31-5	0.010850	6.200000	0.007691
			Subtotal		0.175000	100.0000000	0.124043

Resistor 1	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.023154	96.100000	0.016412
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000096	0.400000	0.000068
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000361	1.500000	0.000256
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000482	2.000000	0.000342
			Subtotal		0.024093	100.0000000	0.017078
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000098
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000008
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000033
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000570
			Subtotal		0.001000	100.0000000	0.000709
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000032
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000001
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000019
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000026
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000630
			Subtotal		0.001000	100.0000000	0.000709
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000118
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000030
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000177
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.000383
			Subtotal		0.001000	100.0000000	0.000709
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001729	99.990000	0.001226
			Subtotal		0.001730	100.0000000	0.001226
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000048
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000535
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000007
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000119
			Subtotal		0.001000	100.0000000	0.000709
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000072	5.510000	0.000051
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	0.900000	0.000008
		Copper and its compounds	Cupric oxide	1317-38-0	0.000012	0.900000	0.000008
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000257	19.540000	0.000182
		Lead and its compounds	Lead monooxide	1317-36-8	0.000074	5.650000	0.000053
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000024	1.800000	0.000017
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000118	9.020000	0.000084
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000118	9.020000	0.000084
		Silver and its compounds	Silver, metal	7440-22-4	0.000565	43.050000	0.000401
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000037	2.810000	0.000026
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000024	1.800000	0.000017
			Subtotal		0.001313	100.0000000	0.000930
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000248
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000461
			Subtotal		0.001000	100.0000000	0.000709
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.002593	99.990000	0.001839
			Subtotal		0.002594	100.0000000	0.001839

Resistor 2	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000098
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000008
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000033
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000570
			Subtotal		0.001000	100.0000000	0.000709
	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.023153	96.100000	0.016411
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000096	0.400000	0.000068
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000361	1.500000	0.000256
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000482	2.000000	0.000342
			Subtotal		0.024092	100.0000000	0.017077
	Conductor	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000248
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000461
			Subtotal		0.001000	100.0000000	0.000709
	Insulation	Chromium and Chromium III compounds	C.I. Pigment Black 28	68186-91-4	0.000050	5.000000	0.000035
		Epoxy Resins	Epikote 862	28064-14-4	0.000741	74.100000	0.000525
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000118
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000030
			Subtotal		0.001000	100.0000000	0.000709
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000048
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000535
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000007
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000119
			Subtotal		0.001000	100.0000000	0.000709
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000072	5.500000	0.000051
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	0.900000	0.000008
		Copper and its compounds	Cupric oxide	1317-38-0	0.000012	0.900000	0.000008
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000256	19.523000	0.000181
		Lead and its compounds	Lead monooxide	1317-36-8	0.000074	5.674000	0.000053
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000024	1.800000	0.000017
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000118	9.000000	0.000083
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000118	9.000000	0.000083
		Silver and its compounds	Silver, metal	7440-22-4	0.000564	43.103000	0.000400
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000037	2.800000	0.000026
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000024	1.800000	0.000017
			Subtotal		0.001310	100.0000000	0.000928
	Termination	Nickel and its compounds	Nickel, metal	7440-02-0	0.001731	40.000000	0.001227
		Tin and its compounds	Tin, metal	7440-31-5	0.002597	60.000000	0.001841
			Subtotal		0.004328	100.0000000	0.003068
	Top Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000032
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000001
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000019
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000026
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000630
			Subtotal		0.001000	100.0000000	0.000709

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	17.018803	89.600000	12.063230
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.170948	0.900000	0.121171
		Nickel and its compounds	Nickel, metal	7440-02-0	0.094971	0.500000	0.067317
		Silver and its compounds	Silver, metal	7440-22-4	0.059832	0.315000	0.042410
		Tin and its compounds	Tin, metal	7440-31-5	1.649646	8.685000	1.169299
			Subtotal		18.994200	100.0000000	13.463426

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.529749	98.000000	0.375495
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.010811	2.000000	0.007663
			Subtotal		0.540560	100.0000000	0.383159

Semiconductor Die 3	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.243784	89.600000	0.172798
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.002449	0.900000	0.001736
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001360	0.500000	0.000964
		Silver and its compounds	Silver, metal	7440-22-4	0.000857	0.315000	0.000607
		Tin and its compounds	Tin, metal	7440-31-5	0.023630	8.685000	0.016750
			Subtotal		0.272080	100.0000000	0.192855

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.018850	0.500000	0.013361
		Silver and its compounds	Silver, metal	7440-22-4	0.113100	3.000000	0.080167
		Tin and its compounds	Tin, metal	7440-31-5	3.638050	96.500000	2.578714
			Subtotal		3.770000	100.0000000	2.672243

Substrate	Copper Foil 1	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000003	0.006000	0.000002
		Copper and its compounds	Copper, metal	7440-50-8	0.050500	99.882000	0.035796
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000046	0.090000	0.000032
		Zinc and its compounds	Zinc, metal	7440-66-6	0.000011	0.022000	0.000008
			Subtotal		0.050560	100.0000000	0.035838
	Copper Foil 2	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000002	0.006000	0.000002
		Copper and its compounds	Copper, metal	7440-50-8	0.037875	99.882000	0.026847
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000034	0.090000	0.000024
		Zinc and its compounds	Zinc, metal	7440-66-6	0.000008	0.022000	0.000006
			Subtotal		0.037920	100.0000000	0.026878
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	0.545524	99.900000	0.386677
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000546	0.100000	0.000387
			Subtotal		0.546070	100.0000000	0.387064
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.001668	99.900000	0.001182
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000001
			Subtotal		0.001670	100.0000000	0.001184
	Nickel Plating	Nickel and its compounds	Nickel, metal	7440-02-0	0.039888	93.000000	0.028273
		Phosphorus compounds	Phosphorus, elemental (not containing red allotrope)	7723-14-0	0.003002	7.000000	0.002128
			Subtotal		0.042890	100.0000000	0.030401
	Palladium Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000001
		Palladium and its compounds	Palladium, metal	7440-05-3	0.001039	99.900000	0.000736
			Subtotal		0.001040	100.0000000	0.000737
	Solder Mask	Aromatic amines and their salts	1,3,5-Triazine-2,4,6-triamine	108-78-1	0.000028	0.100000	0.000020
		Barium and its compounds	Barium sulfate	7727-43-7	0.005483	19.500000	0.003887
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002784	9.900000	0.001973
		Magnesium and its compounds	Talc	14807-96-6	0.000816	2.900000	0.000578
		Organic compounds	Other organic compounds.		0.001519	5.400000	0.001076
		Phosphorus compounds	Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide	75980-60-8	0.000225	0.800000	0.000160
		Polymers	Plastic: EP - Epoxide, Epoxy		0.003487	12.400000	0.002472
		Polymers	Plastic: PAK		0.013779	49.000000	0.009767
			Subtotal		0.028120	100.0000000	0.019932
	Substrate Build Up	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.116692	40.000000	0.082713
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.102106	35.000000	0.072374
		Polymers	Plastic: PI - Polyimide		0.072932	25.000000	0.051696
			Subtotal		0.291730	100.0000000	0.206783

			Total		141.079991	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G37D37T2 Product content declaration of AFSC5G37D37T2		上次修订 Last Revision (GMT): Wednesday, 05 November 2025, 11:56:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	电感 Inductor	O	O	O	O	O	O
电阻 Resistor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 2	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板 Substrate	铜箔 Copper Foil 1	O	O	O	O	O	O
	铜箔 Copper Foil 2	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	钯镀层 Palladium Plating	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O
	有机底物堆积 Substrate Build Up	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G37D37T2		Last Revision (GMT): Wednesday, 05 November 2025, 11:56:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 12 May 2025	Test Report 12 May 2025	Test Report 12 May 2025	Test Report 12 May 2025
Capacitor 1	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 2	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 3	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 4	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 5	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Die Encapsulant		Test Report 16 Jan 2025	Test Report 16 Jan 2025	Test Report 16 Jan 2025	Test Report 16 Jan 2025
Epoxy Adhesive		Test Report 11 Apr 2025	Test Report 11 Apr 2025	Test Report 11 Apr 2025	Test Report 11 Apr 2025
Inductor 1	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Inductor 2	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	INNER GLAZE	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025
	NI PLATING	Not Available	Not Available	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER GLAZE	Test Report 4 Oct 2024Test Report 18 Sep 2025	Test Report 4 Oct 2024Test Report 18 Sep 2025	Test Report 18 Sep 2025	Test Report 18 Sep 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Inductor 3	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	INNER GLAZE	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025
	NI PLATING	Not Available	Not Available	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER GLAZE	Test Report 4 Oct 2024Test Report 18 Sep 2025	Test Report 4 Oct 2024Test Report 18 Sep 2025	Test Report 18 Sep 2025	Test Report 18 Sep 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Inductor 4	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	INNER GLAZE	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER GLAZE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Resistor 1	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Resistor 2	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Semiconductor Die 1	AU BUMPING	Test Report 23 Jun 2025	Test Report 23 Jun 2025	Test Report 23 Jun 2025	Test Report 23 Jun 2025
	DIE	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Semiconductor Die 2		Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Semiconductor Die 3		Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Solder Paste		Test Report 24 Oct 2024	Test Report 24 Oct 2024	Test Report 24 Oct 2024	Test Report 24 Oct 2024
Substrate		Not Available	Not Available	Not Available	Not Available
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Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer