AFSC5G35E38T2

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Product content declaration of AFSC5G35E38T2		Last Revision (GMT): Monday, 26 January 2026, 08:50:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G35E38T2	SOT1831	HLLGA27	159.155578 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Gold (Ni/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 089 76528	2025-12-12	E	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.575040	99.990000	0.361307
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000058	0.010000	0.000036
			Subtotal		0.575098	100.0000000	0.361343

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.033615
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006723
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.013446
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.080676
			Subtotal		0.214000	100.0000000	0.134460
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005654
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005655
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004398
			Subtotal		0.007000	100.0000000	0.004398
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001005
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.045239
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004021
			Subtotal		0.080000	100.0000000	0.050265
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.012565
			Subtotal		0.020000	100.0000000	0.012566

Capacitor 2	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132000	60.000000	0.082938
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022000	10.000000	0.013823
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.041469
			Subtotal		0.220000	100.0000000	0.138229
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007999	99.990000	0.005026
			Subtotal		0.008000	100.0000000	0.005027
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004398
			Subtotal		0.007000	100.0000000	0.004398
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.000955
		Copper and its compounds	Copper, metal	7440-50-8	0.068400	90.000000	0.042977
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.003820
			Subtotal		0.076000	100.0000000	0.047752
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.018998	99.990000	0.011937
			Subtotal		0.019000	100.0000000	0.011938

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.102481	25.000000	0.064391
		Manganese and its compounds	Manganese oxide	1344-43-0	0.020496	5.000000	0.012878
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.040993	10.000000	0.025756
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.245955	60.000000	0.154537
			Subtotal		0.409925	100.0000000	0.257563
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.017061	99.900000	0.010720
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000017	0.100000	0.000011
			Subtotal		0.017078	100.0000000	0.010731
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000026	0.100000	0.000016
		Nickel and its compounds	Nickel, metal	7440-02-0	0.025592	99.900000	0.016080
			Subtotal		0.025617	100.0000000	0.016096
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.005124	2.000000	0.003220
		Copper and its compounds	Copper, metal	7440-50-8	0.230578	90.000000	0.144876
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.020496	8.000000	0.012878
			Subtotal		0.256197	100.0000000	0.160973
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000060	0.100000	0.000038
		Tin and its compounds	Tin, metal	7440-31-5	0.059722	99.900000	0.037524
			Subtotal		0.059782	100.0000000	0.037562

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015084
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003017
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006034
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.036202
			Subtotal		0.096030	100.0000000	0.060337
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002508
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002511
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003762
			Subtotal		0.005994	100.0000000	0.003766
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000754
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.033926
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003016
			Subtotal		0.059994	100.0000000	0.037695
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.008779
			Subtotal		0.013986	100.0000000	0.008788

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015084
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003017
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006034
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.036202
			Subtotal		0.096030	100.0000000	0.060337
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002508
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002511
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003762
			Subtotal		0.005994	100.0000000	0.003766
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000754
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.033926
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003016
			Subtotal		0.059994	100.0000000	0.037695
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.008779
			Subtotal		0.013986	100.0000000	0.008788

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.039146
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.007829
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.015658
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.093951
			Subtotal		0.249213	100.0000000	0.156584
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.006585
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.006585
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.005121
			Subtotal		0.008152	100.0000000	0.005122
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001171
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.052683
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.004683
			Subtotal		0.093163	100.0000000	0.058536
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.014633
			Subtotal		0.023291	100.0000000	0.014634

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.039146
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.007829
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.015658
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.093951
			Subtotal		0.249213	100.0000000	0.156584
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.006585
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.006585
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.005121
			Subtotal		0.008152	100.0000000	0.005122
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001171
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.052683
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.004683
			Subtotal		0.093163	100.0000000	0.058536
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.014633
			Subtotal		0.023291	100.0000000	0.014634

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		4.891100	5.000000	3.073157
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	85.105140	87.000000	53.472923
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	2.934660	3.000000	1.843894
		Inorganic compounds	Carbon Black	1333-86-4	0.489110	0.500000	0.307316
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.097822	0.100000	0.061463
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271686	1.300000	0.799021
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		2.934660	3.000000	1.843894
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.097822	0.100000	0.061463
			Subtotal		97.822000	100.0000000	61.463130

Epoxy Adhesive	Epoxy Adhesive	Anhydrides	Proprietary Material - Other anhydrides		0.028170	3.000000	0.017700
		Epoxy Resins	Proprietary Material-Other Epoxy resins		0.061035	6.500000	0.038349
		Organic Silicon compounds	(3,4-Epoxycyclohexyl)ethyltrimethoxysilane	3388-04-3	0.004695	0.500000	0.002950
		Silver and its compounds	Silver, metal	7440-22-4	0.845100	90.000000	0.530990
			Subtotal		0.939000	100.0000000	0.589989

Inductor 1	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000179	5.000000	0.000112
		Boron and its compounds	Boron oxide	1303-86-2	0.000536	15.000000	0.000337
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000179	5.000000	0.000112
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002504	70.000000	0.001573
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000179	5.000000	0.000112
			Subtotal		0.003577	100.0000000	0.002247
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000009	0.100000	0.000006
		Silver and its compounds	Silver, metal	7440-22-4	0.009403	99.900000	0.005908
			Subtotal		0.009412	100.0000000	0.005914
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.018824	40.000000	0.011827
		Boron and its compounds	Boron oxide	1303-86-2	0.004706	10.000000	0.002957
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.023530	50.000000	0.014784
			Subtotal		0.047059	100.0000000	0.029568
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003102	99.900000	0.001949
			Subtotal		0.003106	100.0000000	0.001951
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000008
		Silver and its compounds	Silver, metal	7440-22-4	0.012693	99.900000	0.007975
			Subtotal		0.012706	100.0000000	0.007983
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.004137	99.900000	0.002599
			Subtotal		0.004141	100.0000000	0.002602

Inductor 2	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000190	5.000000	0.000119
		Boron and its compounds	Boron oxide	1303-86-2	0.000570	15.000000	0.000358
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000190	5.000000	0.000119
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002660	70.000000	0.001672
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000190	5.000000	0.000119
			Subtotal		0.003800	100.0000000	0.002388
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000010	0.100000	0.000006
		Silver and its compounds	Silver, metal	7440-22-4	0.009990	99.900000	0.006277
			Subtotal		0.010000	100.0000000	0.006283
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.020000	40.000000	0.012566
		Boron and its compounds	Boron oxide	1303-86-2	0.005000	10.000000	0.003142
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.025000	50.000000	0.015708
			Subtotal		0.050000	100.0000000	0.031416
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003296	99.900000	0.002071
			Subtotal		0.003300	100.0000000	0.002073
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000008
		Silver and its compounds	Silver, metal	7440-22-4	0.013486	99.900000	0.008474
			Subtotal		0.013500	100.0000000	0.008482
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.004395	99.900000	0.002762
			Subtotal		0.004400	100.0000000	0.002764

Inductor 3	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.019998	99.990000	0.012565
			Subtotal		0.020001	100.0000000	0.012567
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.040000	40.000000	0.025132
		Boron and its compounds	Boron oxide	1303-86-2	0.010000	10.000000	0.006283
		Inorganic Silicon compounds	Quartz	14808-60-7	0.050000	50.000000	0.031415
			Subtotal		0.099999	100.0000000	0.062831
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006598	99.990000	0.004146
			Subtotal		0.006599	100.0000000	0.004147
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.026997	99.990000	0.016962
			Subtotal		0.026999	100.0000000	0.016964
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000380	5.000000	0.000239
		Boron and its compounds	Boron oxide	1303-86-2	0.001140	15.000000	0.000717
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000380	5.000000	0.000239
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005322	70.000000	0.003344
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000380	5.000000	0.000239
			Subtotal		0.007602	100.0000000	0.004777
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.008798	99.990000	0.005528
			Subtotal		0.008799	100.0000000	0.005529

Resistor	Alumina Substrate	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.194663	96.000000	0.122310
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000811	0.400000	0.000510
		Inorganic Silicon compounds	Quartz	14808-60-7	0.004056	2.000000	0.002548
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.003244	1.600000	0.002038
			Subtotal		0.202774	100.0000000	0.127406
	Bottom Conductor	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.001362	20.000000	0.000856
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000340	5.000000	0.000214
		Non-Halogenated Organic Compounds - Specific	Gum rosin, colophony	8050-09-7	0.000681	10.000000	0.000428
		Silver and its compounds	Silver, metal	7440-22-4	0.004427	65.000000	0.002782
			Subtotal		0.006811	100.0000000	0.004279
	Glaze	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.001502	80.000000	0.000944
		Polymers	Ethyl cellulose	9004-57-3	0.000376	20.000000	0.000236
			Subtotal		0.001878	100.0000000	0.001180
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.010941	99.990000	0.006875
			Subtotal		0.010943	100.0000000	0.006875
	Protective Coating	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.001653	40.000000	0.001038
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000826	20.000000	0.000519
		Inorganic compounds	Carbon Black	1333-86-4	0.000413	10.000000	0.000260
		Magnesium and its compounds	Talc	14807-96-6	0.000620	15.000000	0.000389
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000620	15.000000	0.000389
			Subtotal		0.004132	100.0000000	0.002596
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.002299	45.000000	0.001444
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000511	10.000000	0.000321
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.002043	40.000000	0.001284
		Silver and its compounds	Silver (I) oxide	20667-12-3	0.000255	5.000000	0.000160
			Subtotal		0.005108	100.0000000	0.003210
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000431	20.000000	0.000271
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001723	80.000000	0.001082
			Subtotal		0.002153	100.0000000	0.001353
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.010941	99.990000	0.006875
			Subtotal		0.010943	100.0000000	0.006875
	Top Conductor	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000566	10.000000	0.000356
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000057	1.000000	0.000036
		Silver and its compounds	Silver, metal	7440-22-4	0.005037	89.000000	0.003165
			Subtotal		0.005659	100.0000000	0.003556

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	8.509402	89.600000	5.346593
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.085474	0.900000	0.053705
		Nickel and its compounds	Nickel, metal	7440-02-0	0.047485	0.500000	0.029836
		Silver and its compounds	Silver, metal	7440-22-4	0.029916	0.315000	0.018797
		Tin and its compounds	Tin, metal	7440-31-5	0.824823	8.685000	0.518250
			Subtotal		9.497100	100.0000000	5.967180

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.266638	98.000000	0.167533
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005442	2.000000	0.003419
			Subtotal		0.272080	100.0000000	0.170952

Semiconductor Die 3	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	1.610826	98.000000	1.012108
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.032874	2.000000	0.020655
			Subtotal		1.643700	100.0000000	1.032763

Solder Flux	Solder Flux	Copper and its compounds	Copper, metal	7440-50-8	0.000627	2.986400	0.000394
		Glycol Ethers and Acetates - Specific	2-(2-butoxyethoxy)ethanol	112-34-5	0.000571	2.718100	0.000359
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.002615	12.450900	0.001643
		Silver and its compounds	Silver, metal	7440-22-4	0.000904	4.305300	0.000568
		Tin and its compounds	Tin, metal	7440-31-5	0.016283	77.539300	0.010231
			Subtotal		0.021000	100.0000000	0.013195

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007215	0.500000	0.004533
		Silver and its compounds	Silver, metal	7440-22-4	0.043290	3.000000	0.027200
		Tin and its compounds	Tin, metal	7440-31-5	1.392495	96.500000	0.874927
			Subtotal		1.443000	100.0000000	0.906660

Substrate, Pre-plated NiAu	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	2.281387	99.900000	1.433432
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.002284	0.100000	0.001435
			Subtotal		2.283671	100.0000000	1.434867
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	25.074469	99.900000	15.754691
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.025100	0.100000	0.015770
			Subtotal		25.099569	100.0000000	15.770461
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.228312	99.900000	0.143452
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000228	0.100000	0.000144
			Subtotal		0.228541	100.0000000	0.143596
	Solder Mask	Aromatic amines and their salts	1,3,5-Triazine-2,4,6-triamine	108-78-1	0.001426	0.100000	0.000896
		Barium and its compounds	Barium sulfate	7727-43-7	0.278132	19.500000	0.174755
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.141206	9.900000	0.088722
		Magnesium and its compounds	Talc	14807-96-6	0.041363	2.900000	0.025989
		Organic compounds	Other organic compounds.		0.077021	5.400000	0.048394
		Phosphorus compounds	Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide	75980-60-8	0.011411	0.800000	0.007169
		Polymers	Plastic: EP - Epoxide, Epoxy		0.176864	12.400000	0.111126
		Polymers	Plastic: PAK		0.698896	49.000000	0.439128
			Subtotal		1.426319	100.0000000	0.896179
	Substrate Prepreg	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	3.542856	24.000000	2.226033
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	6.613332	44.800000	4.155262
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		1.077619	7.300000	0.677085
		Polymers	Plastic: EP - Epoxide, Epoxy		3.528094	23.900000	2.216758
			Subtotal		14.761901	100.0000000	9.275139

			Total		159.155578	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G35E38T2 Product content declaration of AFSC5G35E38T2		上次修订 Last Revision (GMT): Monday, 26 January 2026, 08:50:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)	邻苯二甲酸二正丁酯(DBP)	邻苯二甲酸二异丁酯(DIBP)	邻苯二甲酸丁基苄酯(BBP)	邻苯二甲酸二（2-乙基）己酯(DEHP)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O	O	O	O	O
电感 Inductor 1	玻璃 Glass	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电感 Inductor 2	玻璃 Glass	O	O	O	O	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电感 Inductor 3	内电极 Inner Electrode	O	O	O	O	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
电阻 Resistor	氧化铝基材 Alumina Substrate	O	O	O	O	O	O	O	O	O	O
	底导体 Bottom Conductor	O	O	O	O	O	O	O	O	O	O
	釉 Glaze	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O	O	O	O	O
基板，镍金预镀 Substrate, Pre-plated NiAu	铜箔 Copper Foil	O	O	O	O	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O	O	O	O	O
	基材预浸料 Substrate Prepreg	O	O	O	O	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注：该半导体产品的环保使用期限（EFUP）为50年。 Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G35E38T2		Last Revision (GMT): Monday, 26 January 2026, 08:50:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 12 May 2025	Test Report 12 May 2025	Test Report 12 May 2025	Test Report 12 May 2025
Capacitor 1	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 2	CERAMIC	Test Report 27 Oct 2025	Test Report 27 Oct 2025	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 3	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 4	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 5	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 6	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Capacitor 7	CERAMIC	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024	Test Report 8 Nov 2024
	INNER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER ELECTRODE	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025	Test Report 21 Aug 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Die Encapsulant		Test Report 16 Jan 2025	Test Report 16 Jan 2025	Test Report 16 Jan 2025	Test Report 16 Jan 2025
Epoxy Adhesive		Test Report 29 Jul 2025	Test Report 29 Jul 2025	Test Report 29 Jul 2025	Not Available
Inductor 1	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Inductor 2	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	INNER GLAZE	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER GLAZE	Test Report 18 Sep 2025	Test Report 18 Sep 2025	Test Report 18 Sep 2025	Test Report 18 Sep 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Inductor 3	ELECTRODE	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025	Test Report 24 Apr 2025
	INNER GLAZE	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025	Test Report 6 Aug 2025
	NI PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
	OUTER GLAZE	Test Report 18 Sep 2025	Test Report 18 Sep 2025	Test Report 18 Sep 2025	Test Report 18 Sep 2025
	SN PLATING	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025	Test Report 28 Mar 2025
Resistor	BOTTOM CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	CERAMIC	Test Report 17 Dec 2024	Test Report 17 Dec 2024	Test Report 17 Dec 2024	Test Report 17 Dec 2024
	INTERNAL ELECTRODE	Not Available	Not Available	Test Report 27 Dec 2019	Test Report 27 Dec 2019
	NI PLATING	Not Available	Not Available	Test Report 4 Oct 2020	Test Report 4 Oct 2020
	OVERCOAT	Test Report 20 Feb 2024	Test Report 20 Feb 2024	Not Available	Not Available
	OVERGLAZE	Test Report 31 Jan 2024	Test Report 31 Jan 2024	Test Report 31 Jan 2024	Test Report 31 Jan 2024
	RESISTIVE LAYER	Not Available	Not Available	Not Available	Not Available
	SECONDARY ELECTRODE	Not Available	Not Available	Test Report 30 Jun 2023	Test Report 30 Jun 2023
	SN PLATING	Not Available	Not Available	Not Available	Not Available
	TERMINAL ELECTRODE	Not Available	Not Available	Not Available	Not Available
	TOP CONDUCTOR	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 1	AU BUMPING	Test Report 23 Jun 2025	Test Report 23 Jun 2025	Test Report 23 Jun 2025	Test Report 23 Jun 2025
	DIE	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Semiconductor Die 2		Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Semiconductor Die 3		Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025	Test Report 1 Jul 2025
Solder Flux		Test Report 11 Oct 2024	Test Report 11 Oct 2024	Not Available	Not Available
Solder Paste		Test Report 24 Oct 2024	Test Report 24 Oct 2024	Test Report 24 Oct 2024	Test Report 24 Oct 2024
Substrate, Pre-plated NiAu		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer