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下記の検索ボックスにパッケージ名や部品番号、マーキング・コードを入力してください。
注意：旧NXPのパッケージおよびパッケージ・データは検索対象に含まれません。
| パッケージバージョン | パッケージ名 | パッケージ説明 | 参照コード | 発行日 |
|---|---|---|---|---|
| SOT1181-1 | HTQFP48 | plastic thermal enhanced thin quad flat package; 48 leads; exposed die pad | MS-026(JEDEC | 2010-08-04 |
| SOT1181-2 | HTQFP48 | HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 mm x 10 mm x 1 mm; exposed die pad | MS-026(JEDEC | 2012-10-23 |
| SOT1522-1 | HTQFP128 | HTQFP128, plastic, thermal enhanced thin quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1 mm body | TS-PQFP-G128(JEDEC | 2017-06-11 |
| SOT1580-1 | HTQFP216 | HTQFP216, plastic, thermal enhanced thin quad flat package; 216 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1 mm body | 2017-06-11 | |
| SOT513-1 | HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink | 2003-02-20 | |
| SOT513-2 | HTQFP80 | HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 1 mm body | TS-PQFP-G80(JEDEC | 2017-06-11 |
| SOT545-1 | HTQFP48 | plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-01-29 |
| SOT545-2 | HTQFP48 | plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-01-29 |
| SOT545-3 | HTQFP48 | plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-02-05 |
| SOT638-1 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2005-02-02 |
| SOT638-2 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2005-02-02 |
| SOT638-3 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2008-04-08 |
| SOT638-4 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2008-11-12 |
| SOT638-5 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2008-11-12 |
| SOT638-6 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad, 0.5 mm pitch, 14 mm x 14 mm x 1 mm body | 2009-09-01 | |
| SOT638-7 | HTQFP100 | HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body | TS-PQFP-G100(JEDEC | 2017-06-11 |
| SOT638-8 | HTQFP100 | HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body | TS-PQFP-G100(JEDEC | 2017-06-11 |
| SOT780-1 | HTQFP52 | plastic thermal enhanced thin quad flat package; 52 leads; body 10 x 10 x 1 mm; exposed die pad | MS-026(JEDEC | 2002-09-04 |
| SOT841-1 | HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-01-15 |
| SOT841-2 | HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-04-21 |
| SOT841-4 | HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad | MS-026(JEDEC | 2006-06-20 |
| SOT841-5 | HTQFP80 | HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1 mm body | TS-PQFP-G80(JEDEC | 2017-06-11 |
| SOT855-1 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad | MS-026(JEDEC | 2005-05-11 |
| SOT855-2 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; 10 x 10 x 1 mm; exposed diepad | 2010-02-15 | |
| SOT855-3 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad | MS-026(JEDEC | 2010-04-22 |
| SOT855-4 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad | MS-026(JEDEC | 2011-04-12 |
| SOT855-5 | HTQFP64 | HTQFP64, thermal enhanced thin quad flat package; 64 terminals, 0.5 mm pitch, 10 mm x 10 mm x 1 mm body | 2018-12-18 | |
| SOT855-6 | HTQFP64 | HTQFP64, thermal enhanced thin quad flat package; 64 terminals, 0.5 mm pitch, 10 mm x 10 mm x 1 mm body; exposed die pad | 2021-12-14 |
