SOT1181-2: HTQFP48

概要

HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 mm x 10 mm x 1 mm; exposed die pad

パッケージバージョン	パッケージ名	マウント	端子位置	パッケージスタイル	外形寸法図	端子数	材料
SOT1181-2	HTQFP48	surface mount	quad	HTQFP	10 x 10 x 1	48	plastic

メーカーコード	参照コード	Issue Date
SOT1181	MS-026(JEDEC	2012-10-23

製品

パーツ	説明	Quick access
UJA1135HW	Buck HS-CAN/LIN system basis chip	View parametrics
UJA1136HW	Buck HS-CAN/dual LIN system basis chip	View parametrics
UJA1131HW	Buck/boost HS-CAN/LIN system basis chip	View parametrics
UJA1132HW	Buck/boost HS-CAN/dual LIN system basis chip	View parametrics
UJA1132AHW	Buck/boost HS-CAN/dual-LIN system basis chip, 5 V/500 mA + 5 V/100 mA, up to 8 HVIO, optional CAN Partial Networking	View parametrics
UJA1131AHW	Buck/boost HS-CAN/LIN system basis chip, 5 V/500 mA + 5 V/100 mA, up to 8 HVIO, optional CAN Partial Networking	View parametrics
UJA1135AHW	Buck HS-CAN/LIN system basis chip, 5V/500mA + 5V/100mA, 8 HVIO	View parametrics
UJA1136AHW	Buck HS-CAN/dual-LIN system basis chip, 5V/500mA + 5V/100mA, 8 HVIO	View parametrics