202503014F01 : MCX A156 A155 A154 A146 A145 A144 Wire and Molding Compound Change on LQFP100 Package
NXP Semiconductors announces the addition of new wire EX1P+ as a wire bond material along with Sumitomo G700Q-B mold compound for the Source Part Numbers devices associated with this notification. This product is now qualified for assembly. This product was previously assembled with PdCu wire and G631SH-Q mold compound.
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Assembly materials | 16-Apr-2025 | 15-Jul-2025 |
変更理由
The transfer from PdCu wire and G631SH-Q mold compound is required for supply assurance.
予想される影響
データシートの改訂: No impact to existing datasheet
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
MCXA144VLL (935459828557) |
- | - | - |
|
MCXA145VLL (935459829557) |
- | - | - |
|
MCXA146VLL (935459831557) |
- | - | - |
|
MCXA154VLL (935459832557) |
- | - | - |
|
MCXA155VLL (935459833557) |
- | - | - |
|
MCXA156VLL (935459834557) |
- | - | - |