202407028F01 : LPC550x in HVQFN48 Changes from MSL1 to MSL3 and Non-dry Pack to Dry Pack

To standardize and align with other products in this HVQFN48 package NXP is changing the moisture sensitivity level for LPC550x from MSL1 to MSL3. The packing method will also change from non-dry pack to dry pack which will include a moisture barrier bag (MBB) desiccant and humidity indicator card. PCN effective date is Nov 02 2024. There is no change to the actual product trays or reels. See attached description of the packing and label changes. All new orders should be on the dry pack parts. For existing backlog on the tray shipment parts all orders need to be converted to the new dry pack part numbers for shipments. For existing backlog on the T&R parts all orders need to be converted to the new dry pack part numbers no later than the effectivity date.

変更理由

To ensure clean dry storage conditions at the customer to guarantee the product shelf life.

対象製品の特定について

Replacement part type created see Parts Affected list The change to dry pack required a change in the orderable part number and product 12NC.

予想される影響

データシートの改訂: No impact to existing datasheet

対象品番