201911006F01 : i.MXRT1064 Redistribution Layer Addition On Flash Die
NXP Semiconductors announces to add a RDL layer (Redistribution Layer) to separate the probing and wire bond pads on flash die for i.MXRT1064. The original bond pads and RDL pads are going to be on separate locations. Original bond pads are used for wafer test probing while RDL pads are for wire bonding process.
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Wafer fab process | 06-Dec-2019 | 05-Mar-2020 |
変更理由
This is to separate the probing and wire bond pads on flash die for manufacturing robustness.
対象製品の特定について
Product identification does not change
予想される影響
No impact on form fit function reliability or quality.
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
MIMXRT1064CVL5A (935377468557) |
- | - | - |
|
MIMXRT1064DVL6A (935377469557) |
- | - | - |
|
MIMXRT1064DVL6AR (935377469518) |
- | - | - |