201804021F01 : NX3P1108UK Assembly(bumping) Transfer from Nexperia(Germany) to SPIL(Taiwan)

NXP is pleased to announce the product assembly transferring (bumping) location from Nexperia (Germany) to SPIL (Taiwan). WLCSP bumping proces is same "UBM + Ball drop" but the solder ball material change from "SOL250" to "SAC105(Ni)"."SAC105(Ni)" is a mature and standard material in NXP and in industry.

変更理由

oNexperia will stop WLCSP bumping activities.The following files included in this PCN provide information about the verification of the changes (if any) in the assembly process: 1)PQIP

対象製品の特定について

Top side marking o Marking line B will change from DS* to AS* (3rd character is production code) o Solder ball material changed. Nexperia is "Sol pearls" and SPIL is SAC105(Ni) o Nominal bump size height reduced from 0.24 mm to 0.23 mm (standardization)

予想される影響

データシートの改訂: A new datasheet will be issued

POD in datasheet updated : nominal bump size height redced from 0.24 mm to 0.23 mm (standardization)No impact on form fit function reliability or quality.

対象品番