201701024F01 : Transition to Inkless for Remaining ICode type

Optimization of the product flow for the wafer delivery of the mentioned product and introduction of state-of-the-art binning information."Electronic fail die marking" rather than application of ink dots is already introduced for the majority of current deliveries and is based on the approved international wafer map standard EG SECS II. The "electronic wafer maps" can be retrieved from a NXP server (http://wmt.nxp.com)

変更理由

"Electronic fail die marking" rather than application of ink dots is already introduced for the majority of current deliveries and is based on the approved international wafer map standard EG SECS II.

対象製品の特定について

Product identification does not change Affected products on film frame carrier (FFC) will be delivered inkless.

予想される影響

データシートの改訂: A new datasheet will be issued

No impact on form fit function reliability or quality.

対象品番